Photosensitive Resin Patterning for Smooth, Chemical-Resistant Films
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Solution Overview
Problem
Existing methods for forming semiconductor packaging using polyimide or polybenzoxazole resins face issues with surface roughness and chemical resistance due to laser exposure, leading to reduced performance of the cured films.
Innovation Solution
A pattern forming method using a photosensitive resin composition containing polyimide or polybenzoxazole precursors, onium salts, and Group 4 element-containing compounds, with specific compounds having carboxy groups and sulfurous ester structures, exposed to laser light followed by development and curing, to enhance surface smoothness and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser exposure is used to improve surface smoothness of cured film, then surface roughness is reduced, but polymer decomposition occurs leading to reduced chemical resistance
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive resin by incorporating specific compounds (sulfurous ester compounds and carboxy group-containing compounds) that modify the polymer's response to laser exposure. These compositional changes allow the polymer to undergo controlled crosslinking rather than decomposition, achieving both surface smoothness and chemical resistance simultaneously
Solution Approach 2:
The patent creates a composite photosensitive resin system combining polyimide or polybenzoxazole precursors with sulfurous ester compounds and carboxy group-containing compounds. This composite material structure enables synergistic effects where the additional compounds protect the main polymer from laser-induced decomposition while promoting beneficial crosslinking reactions
2Ease of manufacture
If conventional photosensitive resin is used, then pattern formation is achieved, but surface roughness is high and chemical resistance is reduced
Solution Approach 1:
The patent modifies the chemical composition of the photosensitive resin by adding sulfurous ester compounds and carboxy group-containing compounds to the conventional polyimide or polybenzoxazole precursor system. These compositional changes enable the resin to form smooth surfaces with high chemical resistance while maintaining pattern formation capability
3Productivity
If laser exposure intensity is increased to improve pattern definition, then exposure efficiency increases, but polymer decomposition is accelerated
Solution Approach 1:
The patent converts the potentially harmful laser exposure effect (which would normally cause polymer decomposition) into a beneficial crosslinking process. By incorporating sulfurous ester compounds and carboxy group-containing compounds, the laser energy is redirected to promote crosslinking reactions that enhance both pattern definition and polymer stability, allowing high exposure efficiency without sacrificing polymer integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces cured films with improved surface smoothness and chemical resistance, suitable for use as interlayer insulating films in semiconductor devices, enhancing their performance and productivity.
Implementation Method 1
it has been found that in a case where the exposure is carried out using the laser light, damage such as decomposition of a polymer in the photosensitive film may occur
Implementation Method 2
the photosensitive film contains at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, and an onium salt
Data Source
Figure 1
AI summary
There is provided a pattern forming method that includes an exposure step of exposing a photosensitive film to laser light; and a development step of developing the photosensitive film after the exposure to obtain a pattern, where the photosensitive film contains at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, and an onium salt.