Resin Polishing Agent Composition for Fast Planarization
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Solution Overview
Problem
The challenge is to develop a polishing agent and method that can efficiently polish surfaces containing resin to a highly flattened state at a high speed, particularly in 3D packaging where resin layers like redistribution layers require precise flattening and the manufacturing process demands increased efficiency.
Innovation Solution
A polishing agent comprising abrasive grains, a water-soluble nitrogen-containing compound, and water, where the nitrogen-containing compound is represented by specific formulas (1) to (3) or their salts, is used. This agent is designed to reduce the material strength of the resin, allowing for high-speed polishing with minimized force and reduced polishing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional polishing agents are used on resin surfaces, then polishing can be performed, but the polishing speed is slow and the surface cannot be highly flattened
Solution Approach 1:
The patent changes the chemical parameters of the polishing agent by incorporating specific nitrogen-containing compounds (formulas 1-3) that react with resin materials. This chemical parameter change enables both high polishing speed and superior surface flatness by modifying how the polishing agent interacts with the resin surface at the molecular level.
Solution Approach 2:
The polishing agent uses a composite formulation combining abrasive grains with specifically structured nitrogen-containing compounds. This composite approach allows the material to simultaneously provide mechanical abrasion for speed and chemical interaction for precision flattening of resin surfaces.
2Productivity
If polishing force is increased to achieve high-speed polishing, then productivity improves, but polishing damage increases
Solution Approach 1:
The patent replaces purely mechanical polishing action with a chemically-assisted process. The nitrogen-containing compounds chemically interact with the resin to reduce its strength, allowing lower mechanical forces to achieve the same polishing effect, thereby reducing polishing damage while maintaining high speed.
Solution Approach 2:
By changing the chemical composition parameters of the polishing agent to include specific nitrogen-containing compounds, the patent modifies the interaction mechanism between the polishing agent and resin. This enables effective polishing at reduced forces, minimizing damage while preserving productivity.
3Manufacturing precision
If multiple polishing steps are added to achieve high flatness, then manufacturing precision improves, but the number of process steps increases and efficiency decreases
Solution Approach 1:
The polishing agent is designed with multi-functional nitrogen-containing compounds that simultaneously provide abrasion assistance, chemical reaction with resin, and surface flattening capabilities. This single agent performs multiple functions that would otherwise require separate process steps, streamlining the manufacturing process.
Solution Approach 2:
By adjusting the chemical parameters of the polishing agent to include specific nitrogen-containing compounds with optimized structures (formulas 1-3), the patent achieves superior surface flatness in a single polishing step, eliminating the need for multiple sequential polishing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables high-speed polishing of resin surfaces to a highly flattened state, improving manufacturing efficiency while minimizing polishing damage and maintaining excellent flatness.
Implementation Method 1
the water-soluble nitrogen-containing compound contains a compound represented by below-shown Formulae (1) to (3) or a salt thereof
Data Source
AI summary
A polishing agent, an additive solution for a polishing agent, and a polishing method by which it is possible to polish a surface to be polished containing a resin to a highly flattened state at a high speed are provided. A polishing agent for polishing a surface to be polished containing a resin contains abrasive grains, a water-soluble nitrogen-containing compound and water, in which the water-soluble nitrogen-containing compound contains a compound represented by below-shown Formulae (1) to (3) or a salt thereof. Note that reference numerals are as described in the specification.