Resin Polishing Slurry Chemistry for Fast Flat CMP
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor manufacturing is to efficiently polish surfaces containing resin to a highly flattened state at a high speed, particularly in 3D packaging where resin layers like redistribution layers need to be flattened quickly to enhance manufacturing efficiency.
Innovation Solution
A polishing agent comprising abrasive grains, a water-soluble nitrogen-containing compound, and water, where the nitrogen-containing compound is represented by specific Formulae (1) to (3) or their salts, is used to reduce resin material strength, allowing high-speed polishing with minimal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional CMP methods are used to polish resin surfaces, then the resin can be flattened, but the polishing speed is slow and manufacturing efficiency is reduced
Solution Approach 1:
The patent changes the chemical parameters of the polishing slurry by incorporating specific water-soluble nitrogen-containing compounds (amino acids, amines, or amides) that selectively interact with resin materials. This chemical parameter modification enables faster removal rates for resin surfaces while maintaining control over polishing characteristics, thus improving productivity without sacrificing flatness
Solution Approach 2:
The patent uses a composite polishing slurry system combining abrasive particles with water-soluble nitrogen-containing compounds. This composite formulation creates a synergistic effect where the abrasives provide mechanical removal and the nitrogen-containing compounds provide chemical assistance, enabling high-speed polishing of resin surfaces while maintaining manufacturing precision
2Productivity
If polishing is performed at higher speed to improve manufacturing efficiency, then productivity increases, but damage to the resin surface may increase
Solution Approach 1:
The patent replaces purely mechanical abrasion with a chemically-assisted mechanical process. The water-soluble nitrogen-containing compounds chemically interact with the resin, softening or breaking down polymer chains, which reduces the mechanical stress and damage during high-speed polishing while maintaining high removal rates
Solution Approach 2:
The water-soluble nitrogen-containing compounds act as intermediary substances between the abrasive particles and the resin surface. These intermediaries facilitate the removal process by chemically modifying the resin surface properties, allowing faster polishing speeds without direct harsh mechanical contact that would cause damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polishing agent achieves high-speed polishing of resin surfaces with reduced damage, ensuring excellent flatness and removal rates, suitable for various resin materials including polyimide and epoxy resin.
Implementation Method 1
the water-soluble nitrogen-containing compound contains a compound represented by below-shown Formulae (1) to (3) or a salt thereof... to reduce resin material strength
Data Source
Figure 1
AI summary
A polishing agent, an additive solution for a polishing agent, and a polishing method by which it is possible to polish a surface to be polished containing a resin to a highly flattened state at a high speed are provided. A polishing agent for polishing a surface to be polished containing a resin contains abrasive grains, a water-soluble nitrogen-containing compound and water, in which the water-soluble nitrogen-containing compound contains a compound represented by below-shown Formulae (1) to (3) or a salt thereof. Note that reference numerals are as described in the specification.