Resin Porous Plug for Electrostatic Chuck Gas Flow
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Solution Overview
Problem
The existing electrostatic chuck for semiconductor manufacturing requires a costly double firing process for the ceramic plate and porous plug, increasing manufacturing costs and potentially leading to arc discharge issues if not properly managed.
Innovation Solution
A semiconductor manufacturing apparatus with a ceramic plate and a press-fitted resin porous plug that allows gas flow, eliminating the need for firing the plug and enabling easy replacement, which reduces costs and inhibits arc discharge by ensuring the plug is in contact with the conductive base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a porous plug is formed by firing ceramic mixture paste in a through-hole, then arc discharge is inhibited and gas flow is controlled, but manufacturing costs increase due to requiring a second firing process
Solution Approach 1:
The patent replaces the expensive, permanent ceramic porous plug with a cheaper resin porous plug that can be easily replaced. The resin plug is inserted into the through-hole without requiring firing, significantly reducing manufacturing costs. Although resin has lower heat resistance than ceramic, it suffices for the required function of inhibiting arc discharge and controlling gas flow, making it an acceptable trade-off for cost reduction.
Solution Approach 2:
The patent changes the material parameter from ceramic to resin, which has different thermal and mechanical properties. This material substitution allows the plug to be installed without high-temperature firing, eliminating the need for a second firing process while still achieving the desired arc discharge inhibition and gas flow control functions.
2Ease of manufacture
If a resin porous plug is press-fitted into the plug insertion hole, then manufacturing cost is reduced by eliminating firing, but the plug may not be securely fixed
Solution Approach 1:
The patent performs preliminary actions to ensure secure fixing of the resin plug before it is installed. The inner diameter of the plug insertion hole is made slightly smaller than the outer diameter of the resin plug to create an interference fit. Additionally, the lower surface of the resin plug is formed with a larger diameter than the upper surface, creating a flange-like structure that prevents the plug from falling out and enhances fixing strength without requiring additional fastening operations.
Solution Approach 2:
The patent uses a composite structure where the resin plug combines different geometric features (varying diameters along its length) to achieve both easy installation and secure fixing. The composite design of the plug geometry allows it to be press-fitted firmly into the hole while maintaining the ability to be replaced if needed, balancing fixing strength with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs by eliminating the need for a second firing step and prevents arc discharge by ensuring the resin porous plug is in contact with the conductive base, maintaining wafer quality and efficiency in gas flow.
Implementation Method 1
heat conduction between the wafer and the ceramic plate is improved
Implementation Method 2
the helium gas passes through pores of the porous plug
Implementation Method 3
the porous plug inhibits arc discharge from occurring because the electrons collide with the porous plug before the electrons collide with the other helium
Implementation Method 4
electrons that are generated by ionization of helium are accelerated and collide with another helium
Implementation Method 5
an electrostatic chuck that has an upper surface including a wafer placement surface... a wafer is attracted and held
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes a ceramic plate that has an upper surface including a wafer placement surface and resin porous plugs that have upper surfaces that are exposed from the wafer placement surface. The resin porous plugs are press-fitted and secured in plug insertion holes that extend through the ceramic plate in an up-down direction and allow gas to flow.