Resin Protected Sensor with Protruding Studs
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Solution Overview
Problem
Existing protective methods for electronic components in automotive applications, such as immersion in resin, are prone to cracking due to temperature and pressure variations, leading to exposure and oxidation of welds or tracks, which reduces the component's lifespan.
Innovation Solution
A housing with a cavity filled with resin, where the electronic component rests on studs protruding from the bottom, ensuring the sensitive element is exposed while the resin extends up to the side wall, and the studs are spaced more than 1 mm from the side wall or in contact with it, preventing bubble formation and subsequent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is immersed in resin to protect it from the external environment, then the protection against environmental factors is improved, but air bubbles may form in the resin causing cracks that reduce the component's lifespan
Solution Approach 1:
The stud is positioned in advance during component assembly, creating a predetermined pathway that guides resin flow and prevents bubble entrapment before the resin pouring process begins
Solution Approach 2:
The stud acts as an intermediary element between the electronic component and the resin, facilitating proper resin distribution and preventing bubble formation by serving as a flow guide and deaeration pathway
2Volume of stationary object
If the stud is placed close to the side wall to maximize space utilization, then the housing capacity is improved, but air bubbles may form between the stud and side wall causing cracks
Solution Approach 1:
The spacing requirement applies specifically to the critical region near the side wall where bubble entrapment is most likely, while other regions of the housing can maintain tighter spacing to optimize capacity
3Reliability
If the resin is poured to completely cover the electronic component for maximum protection, then the environmental sealing is improved, but the sensitive element cannot be exposed to its environment
Solution Approach 1:
The resin coverage is applied selectively - fully covering most of the electronic component for protection, while deliberately leaving the sensitive element exposed to maintain its environmental sensing capability
Data Source
Figure 1~3
AI summary
The present invention concerns a device comprising: -a casing (10) comprising a side wall and a bottom (18) so as to define a cavity (12); - a resin (14) filling the cavity in such a way as to submerge the electronic component, leaving said sensitive element protruding. -an electronic component (32) comprising a sensor (34) provided with a sensitive element (36); -the electronic component resting on at least one pad (30) protruding from said side wall or from said bottom, so as to prevent air bubbles from forming in the resin, the pad being separated from the side wall (16) by a distance d greater than 1 mm or in contact with the side wall (16).