Resin Sheet Tack Control for Electronic Device Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Resin sheets with high inorganic filler content easily shift out of position when contacting the internal surface of vacuum package containers, leading to defects in electronic device sealing.
Innovation Solution
A resin sheet with a probe tack of 5 g to 500 g at 25°C and surface roughness of 400 nm or less, containing 60-90% inorganic filler and epoxy or phenolic resins with a softening point of 100°C or lower, which enhances tack properties without compromising thermal expansion coefficient or water absorption, preventing deformation and shifting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the resin sheet contains high inorganic filler content (60-90% by volume), then the thermal expansion coefficient and water absorption percentage are reduced, but the resin sheet easily shifts out of position when contacting the internal surface of the vacuum package container
Solution Approach 1:
The patent changes the physical and chemical parameters of the resin sheet by controlling the softening point of the resin component to be 100°C or lower, and adjusting the inorganic filler content to 60-90% by volume. These parameter changes enable the resin to achieve optimal balance between dimensional stability (low thermal expansion) and positioning accuracy (resistance to shifting during sealing)
Solution Approach 2:
The patent uses a composite material system consisting of resin (with specific softening point characteristics) and inorganic filler (60-90% by volume). This composite structure combines the low thermal expansion properties of inorganic materials with the adhesive and processability characteristics of the resin matrix, resolving the contradiction between stability and positioning accuracy
2Stability of the object's composition
If the resin sheet contains high inorganic filler content (60-90% by volume), then the water absorption percentage is reduced, but the resin sheet easily shifts out of position when contacting the internal surface of the vacuum package container
Solution Approach 1:
The patent changes the compositional parameters by setting inorganic filler content at 60-90% by volume, which simultaneously achieves low water absorption percentage and maintains positioning accuracy through the controlled softening point of the resin component at 100°C or lower
3Reliability
If the resin sheet has low softening point resin (100°C or lower), then the tack property is improved (probe tack of 5-500 g at 25°C), but the thermal expansion coefficient may increase
Solution Approach 1:
The patent employs a composite material system where low softening point resin (providing tack) is combined with high content inorganic filler (60-90% by volume, providing low thermal expansion). This composite structure balances the conflicting properties of tack and thermal expansion stability
Solution Approach 2:
The patent optimizes the parameter balance by controlling the resin softening point at 100°C or lower for adequate tack while simultaneously maintaining inorganic filler content at 60-90% by volume to keep thermal expansion coefficient low, achieving optimal performance through parameter coordination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin sheet effectively maintains its position during sealing, reducing defects and ensuring reliable sealing of electronic devices in vacuum package containers while maintaining low thermal expansion and water absorption.
Implementation Method 1
the resin sheet has a probe tack of 5 g to 500 g at 25° C.
Data Source
AI summary
Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.