Resin Substrate Laser Separation via Metal Oxide Release Layer
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Solution Overview
Problem
Existing methods for manufacturing flexible electronic devices on resin substrates face challenges in ensuring flatness and preventing deformation during the separation from support substrates, leading to potential damage to functional elements and limitations in using transparent resins due to the pressure of decomposition gases or hydrogen generated during laser processing.
Innovation Solution
A method involving a support substrate with a release layer of metal or metal oxide, where laser light is applied through the substrate to separate the resin substrate without reaching the interface, controlling the energy density to prevent decomposition and deformation, and using a metal-fluorine bond to facilitate separation with lower energy density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser light is applied through the support substrate to separate the resin substrate, then separation is achieved, but the resin substrate deforms due to decomposition gas pressure
Solution Approach 1:
A release layer comprising a metal or metal oxide is introduced between the support substrate and the resin substrate. This release layer acts as an intermediary that absorbs laser light energy and generates gas pressure to facilitate separation, while preventing the laser light from directly decomposing the resin substrate and causing deformation.
Solution Approach 2:
The patent replaces direct mechanical or thermal separation methods with laser-induced gas pressure generation in the release layer. The laser light energy is converted to gas pressure within the release layer, which mechanically pushes the resin substrate away from the support substrate without direct contact or decomposition of the resin substrate.
2Ease of manufacture
If laser energy density is increased to ensure separation, then separation effectiveness improves, but transparent resins cannot be used due to decomposition
Solution Approach 1:
The release layer serves as a mediator that selectively absorbs laser light energy. By positioning the release layer between the support substrate and the resin substrate, it captures the laser energy needed for separation while preventing the laser light from reaching and decomposing the transparent resin substrate.
Solution Approach 2:
The patent changes the optical parameters of the system by introducing a release layer with specific laser light absorption characteristics. This layer has high absorption coefficient for the laser wavelength used, allowing separation to occur at lower energy densities that do not cause decomposition of transparent resins.
3Ease of manufacture
If conventional glass substrate processes are used for resin substrates, then manufacturing experience is available, but flexure of resin substrate makes it difficult to ensure flatness
Solution Approach 1:
The release layer acts as a temporary intermediary support that allows the flexible resin substrate to be handled using conventional glass substrate manufacturing processes. During processing, the release layer provides a stable interface. After processing, laser separation through the release layer cleanly detaches the resin substrate without causing deformation, maintaining flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents deformation of the resin substrate during separation, allows for the use of transparent resins, and ensures the integrity of functional elements by controlling the energy density of the laser light and utilizing a release layer with low transmittance and oxygen-deficient metal oxides.
Implementation Method 1
separating the resin substrate from the support substrate by applying laser light to the support substrate through the second surface
Implementation Method 2
separates the resin substrate from the support substrate utilizing the pressure of hydrogen gas generated from the release layer (i.e. amorphous silicon) by the application of laser light
Implementation Method 3
controlling the energy density to prevent decomposition and deformation, and using a metal-fluorine bond to facilitate separation with lower energy density
Data Source
AI summary
An electronic component manufacturing method according to an aspect of the present disclosure includes providing a support substrate, forming a release layer including a metal or a metal oxide on a first surface of the support substrate, forming a resin substrate on the release layer, forming a functional element on the resin substrate, and separating the resin substrate from the support substrate by applying laser light to the support substrate through a second surface of the support substrate. The laser light that reaches an interface between the resin substrate and the release layer after being transmitted through the support substrate and the release layer has an energy density lower than a threshold for the resin substrate to be processed by the laser light.