Resin Substrate Conductive Particle Spacing for Short Circuit Prevention
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Solution Overview
Problem
Conventional resin substrates are prone to electrostatic discharge damage and have a high occurrence of short circuits between conductor patterns due to the mixing of conductive particles, which increases electrical resistivity and manufacturing failures.
Innovation Solution
A resin substrate with an insulating base material containing conductive particles, where the distance between adjacent conductor patterns on the same surface is increased to prevent short circuits, and the substrate is designed to reduce electrical resistivity and prevent charging, using carbon as a conductive material with high chemical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive particles are mixed with resin to reduce electrical resistivity, then the resin substrate becomes difficult to charge, but the occurrence rate of short circuit between conductor patterns increases
Solution Approach 1:
The patent applies different treatments to different regions: conductive particles are mixed throughout the resin bulk to provide electrostatic protection, while the surface is treated with a release agent to prevent particle aggregation and short circuits between conductor patterns. This local differentiation resolves the contradiction between bulk conductivity and surface insulation.
Solution Approach 2:
The patent creates a composite resin material combining conductive particles (carbon black or metal particles) dispersed in the resin matrix, with additional surface treatment using a release agent. This composite structure provides both electrostatic discharge protection through the conductive particles and short circuit prevention through the surface-treated region.
2Reliability
If conductive particles are mixed with resin to prevent charging, then electrical resistivity is reduced, but insulation between conductor patterns deteriorates
Solution Approach 1:
The patent differentiates between bulk properties and surface properties: the bulk resin contains conductive particles for charging prevention, while the surface is treated with a release agent to maintain insulation performance and prevent harmful short circuits between adjacent conductor patterns.
Solution Approach 2:
The release agent acts as an intermediary substance between the conductive particles and the conductor patterns. It prevents direct contact between conductive particles and conductor patterns, thereby maintaining insulation performance while allowing the bulk resin to provide charging prevention through its conductive particles.
3Area of stationary object
If conductor patterns are placed closer together to increase density, then substrate area is reduced, but the risk of short circuit through conductive particles increases
Solution Approach 1:
The release agent serves as an intermediary barrier between adjacent conductor patterns, preventing conductive particles from bridging the gap between patterns. This allows conductor patterns to be placed closer together, reducing substrate area while maintaining manufacturing precision and preventing short circuits.
Solution Approach 2:
The release agent functions as a temporary protective layer during manufacturing that can be easily applied and removed or remains as a thin protective film. It provides inexpensive protection against short circuits during the manufacturing process, enabling higher pattern density without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the occurrence of electrostatic discharge damage and short circuits, maintaining insulation while lowering electrical resistivity, thus enhancing manufacturing yield and preventing failures in electronic devices.
Implementation Method 1
the insulating base material includes a primary insulating base material in which a plurality of conductive particles are mixed with resin
Data Source
AI summary
A resin substrate includes an insulating base material in which conductive particles are mixed with resin, and conductor patterns provided on the principal surfaces of the insulating base material. When a length at a position at which a distance between two conductor patterns that are adjacent to each other without directly electrically connecting to each other on the same principal surface of the insulating base material is smallest is indicated by L1 and a length at a position at which a distance between two conductor patterns that face each other without directly electrically connecting to each other between the different principal surfaces of insulating base materials is smallest is indicated by L2, L1 is larger than or equal to L2 (L1≥L2).