Resist Coating Distribution Calculation for Imprint Lithography
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Solution Overview
Problem
The existing imprint methods for transferring patterns from a template to a substrate often result in dimension, density, position, and depth deviations, leading to resist filling failures and reduced throughput due to inaccuracies in resist coating distribution calculations based on designed patterns.
Innovation Solution
A method and system for calculating resist coating distribution using actual template pattern data, which includes information on density, position, dimension, sidewall angle, and depth, to adjust the resist distribution accurately, ensuring proper filling and reducing defects by considering variations in the template production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If resist coating distribution is calculated based on designed pattern, then calculation process is simple, but resist filling accuracy deteriorates due to template fabrication variations
Solution Approach 1:
The invention measures the actual template pattern before resist coating and uses this measured data to calculate the resist coating distribution in advance. This preliminary measurement and calculation based on actual template geometry ensures accurate resist filling while accounting for fabrication variations that occur during template manufacturing.
Solution Approach 2:
The invention introduces a feedback loop where the actual template pattern is measured and used to adjust the resist coating distribution calculation. This feedback mechanism allows the system to adapt to real template variations rather than relying solely on designed pattern data, thereby improving filling accuracy.
2Manufacturing precision
If resist coating distribution is adjusted based on actual template pattern, then resist filling accuracy is improved, but measurement and calculation complexity increases
Solution Approach 1:
The measurement of the actual template pattern is performed before resist coating, allowing the system to prepare the appropriate resist coating distribution in advance. This preliminary measurement enables subsequent accurate resist application without requiring complex real-time adjustments during the coating process.
3Productivity
If resist filling is performed without accurate coating distribution, then processing speed is fast, but filling failures and defects increase
Solution Approach 1:
The resist coating distribution is calculated in advance based on measured actual template pattern data, allowing the resist to be applied accurately in a single coating operation. This preliminary calculation eliminates the need for multiple trial coatings or adjustments, thereby maintaining high processing speed while ensuring reliable filling.
Solution Approach 2:
The invention adjusts the resist coating distribution parameters (such as coating amount, thickness, or pattern) based on the measured actual template geometry. By changing these parameters to match the real template conditions, the system achieves both accurate filling and efficient processing without defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of resist filling, reduces defects, and increases throughput by accurately determining the resist coating distribution based on the actual template pattern, ensuring efficient pattern transfer and improved substrate processing.
Implementation Method 1
the filled resist is cured by irradiating light, for example, so that the pattern is transferred
Data Source
AI summary
In one embodiment, a method of forming a resist pattern on a substrate is provided. Information of a template pattern formed on a template based on template pattern data is obtained. A resist coating distribution is set based on the information of the template pattern. A resist is formed on a substrate based on the resist coating distribution. The template is brought into contact with the resist formed on the substrate so that the resist is filled into the template pattern formed on the template. The filled resist is cured. The template is separated from the cured resist so that a resist pattern is formed on the substrate.