Chemically Amplified Resist Composition for High-Sensitivity Patterning
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Solution Overview
Problem
Chemically amplified positive resist compositions face challenges in forming patterns with high sensitivity and short development times without generating dimples on pattern sidewalls, due to differences in alkaline dissolution rates between base and alkali-soluble resins.
Innovation Solution
A chemically amplified positive resist composition combining a specific base resin with an alkali-soluble polymer, a photoacid generator, and an organic solvent, where the alkali-soluble polymer has a controlled alkaline dissolution rate and is selected from phenolic resin, urethane resin, or polyhydroxystyrene, ensuring uniform dissolution rates and preventing dimple formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an alkali-soluble resin comprising hydroxystyrene units is added to a chemically amplified positive resist composition to increase sensitivity and reduce development time, then the dissolution rate of the base resin increases, but dimples are generated in pattern sidewalls due to substantial difference in alkaline dissolution rate between the base resin and the alkali-soluble resin
Solution Approach 1:
The patent changes the chemical structure parameters of the alkali-soluble resin by specifying precise compositional ratios (0.3 ≤ p/(p+q+r+s) ≤ 0.8 for hydroxystyrene units, 0.05 ≤ r/(p+q+r+s) ≤ 0.3 for carboxyl-containing vinyl monomer units) to achieve optimal dissolution rate matching between base resin and alkali-soluble resin, thereby preventing dimple formation while maintaining high sensitivity and short development time
Solution Approach 2:
The patent creates a composite resist system by combining specifically formulated alkali-soluble resin (with controlled composition ratios) with base resin and photoacid generator, where the composite achieves synergistic effects of high sensitivity, short development time, and uniform dissolution rate that prevents pattern sidewall defects
2Manufacturing precision
If the dissolution rate of the alkali-soluble resin is increased to match the base resin dissolution rate, then dimple formation is prevented, but the sensitivity and development time performance may be compromised
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: the compositional ratios of the alkali-soluble resin (hydroxystyrene units 0.3-0.8, carboxyl-containing vinyl monomer units 0.05-0.3), the molecular weight (1,000-500,000), and the amounts of each component (base resin 90-99.9 parts, alkali-soluble resin 0.1-10 parts) to achieve the optimal balance between dissolution rate matching and high sensitivity performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables high-sensitivity pattern formation within short development times without generating dimples on pattern sidewalls, ensuring consistent and precise pattern profiles.
Implementation Method 1
a polymer adapted to turn soluble in alkaline aqueous solution under the action of acid
Implementation Method 2
exposing the resist film to UV radiation having a wavelength of at least 300 nm
Data Source
AI summary
A chemically amplified positive resist composition is provided comprising a specific alkali-soluble polymer adapted to turn soluble in alkaline aqueous solution under the action of acid as base resin, an alkali-soluble polymer, and a photoacid generator in an organic solvent. The composition forms a resist film which can be briefly developed to form a pattern at a high sensitivity without generating dimples in pattern sidewalls.