Resist Composition Line Edge Roughness Defect Reduction
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Solution Overview
Problem
Conventional resist compositions fail to consistently achieve satisfactory pattern line edge roughness and often result in a high number of defects in the resist pattern.
Innovation Solution
A resist composition comprising a resin with specific structural units, an acid generator, and a compound, applied to a substrate, dried, exposed, and developed, which includes a resin insoluble in alkali aqueous solution but becomes soluble upon acid action, and further includes a solvent and a compound represented by a specific formula, to improve line edge roughness and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist composition is used, then the resist pattern can be formed, but the line edge roughness is poor and the number of defects increases
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by incorporating specific compounds (formula I with fluorinated groups and formula II with aromatic rings) and adjusting their proportions. This modifies the dissolution behavior and etching resistance parameters, resulting in improved line edge roughness and reduced defects while maintaining pattern formation capability
Solution Approach 2:
The patent creates a composite resist composition by combining multiple components: resin (A1) with specific structural units, resin (A2) that is insoluble in alkali but soluble upon acid action, acid generator (B), and compounds of formula (I) and (II). This composite structure synergistically improves both line edge roughness and defect reduction while enabling successful pattern formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves excellent line edge roughness and minimizes defects in the resist pattern, making it suitable for semiconductor microfabrication and other photofabrication processes.
Implementation Method 1
a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator
Data Source
AI summary
A resist composition of the present invention has (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator and (D) a compound represented by the formula (II).wherein R1 represents a hydrogen atom or a methyl group; A1 represents a C1 to C6 alkanediyl group; R2 represents a C1 to C10 hydrocarbon group having a fluorine atom, R3 and R4 in each occurrence independently represent a C1 to C12 hydrocarbon group, a C1 to C6 alkoxyl group, a C2 to C7 acyl group, a C2 to C7 acyloxy group, a C2 to C7 alkoxycarbonyl group, a nitro group or a halogen atom; m′ and n′ independently represent an integer of 0 to 4.