Radiation-Sensitive Resist Composition for Fine Pattern Fidelity
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Solution Overview
Problem
Existing photolithography technologies face challenges in achieving high sensitivity, line width roughness (LWR) performance, depth of focus (DOF) performance, pattern rectangularity, critical dimension uniformity (CDU), pattern circularity, exposure latitude (EL), and pattern collapse resistance in the formation of fine circuits for semiconductor devices.
Innovation Solution
A radiation-sensitive composition containing an onium salt with a specific structure, a polymer with an acid-dissociable group, and a solvent is used to form a resist film, which is exposed and developed to enhance sensitivity, LWR performance, DOF performance, pattern rectangularity, CDU performance, pattern circularity, and EL performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithography methods are used, then existing processes can be maintained, but sensitivity, LWR performance, DOF performance, pattern rectangularity, CDU performance, pattern circularity, and EL performance are insufficient
Solution Approach 1:
The patent modifies the chemical parameters of the resist composition by incorporating specific onium salts with defined structures (formula 1) and controlling their content ratios. This changes the photochemical reaction characteristics, leading to improved sensitivity, LWR performance, and pattern quality while maintaining process reliability
Solution Approach 2:
The patent creates a composite resist system combining onium salts with specific polymers and solvents. This composite material approach allows synergistic effects that simultaneously improve multiple performance parameters including sensitivity, DOF performance, and pattern circularity that cannot be achieved with single components
2Length of moving object
If short-wavelength radioactive ray is used, then pattern micronization is promoted, but sensitivity and exposure latitude may be reduced
Solution Approach 1:
The patent adjusts the photochemical parameters by selecting onium salts with appropriate absorption characteristics and reaction efficiencies. This allows the resist to maintain high sensitivity even when exposed to short-wavelength radiation, resolving the trade-off between pattern micronization and sensitivity
3Manufacturing precision
If acid diffusion is increased to improve exposure uniformity, then DOF performance improves, but pattern collapse resistance may deteriorate
Solution Approach 1:
The patent creates local variations in acid concentration and reaction kinetics through the specific onium salt structure and distribution. This allows different regions of the resist to have optimized properties: sufficient acid diffusion for exposure uniformity in exposed areas, while maintaining structural integrity in unexposed areas for pattern collapse resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of high-quality resist patterns with improved sensitivity, LWR performance, DOF performance, pattern rectangularity, CDU performance, pattern circularity, and EL performance, addressing the limitations of existing technologies.
Implementation Method 1
a radiation-sensitive composition includes: an onium salt represented by formula (1)... exposing the resist film to light
Data Source
AI summary
A radiation-sensitive composition includes: an onium salt represented by formula (1); a polymer including a structural unit (I) which includes an acid-dissociable group; and a solvent. Q1 and Q2 are each independently a carbon atom or a nitrogen atom, provided that at least one selected from the group consisting of Q1 and Q2 is a carbon atom; W is a monocyclic or polycyclic non-aromatic ring structure of 3 to 40 ring members together with Q1 and Q2, and the formula between Q1 and Q2 represents a single bond or a double bond, R1 is a monovalent organic group having 1 to 20 carbon atoms, a nitro group, a hydroxy group, an amino group, a thiol group, a cyano group, a carboxy group, or halogen atom; m1 is an integer of 0 to 4; and Z+ is a monovalent onium cation.