Resist Composition Inspection via Coating Removal Defect Transfer
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Solution Overview
Problem
Current inspection methods for semiconductor devices are insufficient in detecting ultra-small foreign substances in resist compositions, particularly for nodes smaller than 10 nm, due to limitations in detection sensitivity and accuracy, especially after exposure and thermosetting treatments.
Innovation Solution
An inspection method involving the application of actinic ray-sensitive or radiation-sensitive compositions onto a substrate, followed by removal with an organic solvent without exposure or thermosetting, and subsequent defect measurement using a defect inspection device, allowing for the detection of ultra-small defects on a silicon wafer with improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a liquid-borne particle counter is used to measure foreign substances in resist composition, then the inspection method is simple, but the detection sensitivity is insufficient for particles with diameter of 0.1 µm or less
Solution Approach 1:
The patent introduces an intermediary substance (colloidal silica or polystyrene particles) with known size and properties to calibrate and enhance the detection capability of the inspection system. This intermediary serves as a reference standard that enables the system to detect ultra-small foreign substances that would otherwise be below the detection limit of conventional particle counters
Solution Approach 2:
The patent changes the detection parameter from direct particle counting to measuring the effect of foreign substances on a standardized substrate after resist application. By transforming the inspection approach to measure substrate defects rather than particles in suspension, the system achieves detection sensitivity for sub-0.1 µm particles
2Measurement precision
If a defect inspection device is used to measure foreign substances on film surface, then the detection capability is enhanced, but defects with size of 40-60 nm cannot be sufficiently detected for 10 nm node devices
Solution Approach 1:
The patent performs preliminary action by applying the resist composition to a substrate and removing it before inspection, thereby transferring any foreign substances to the substrate where they can be detected as defects. This preliminary preparation enables the inspection system to detect ultra-small foreign substances that would be invisible in the liquid state or on the film surface
Solution Approach 2:
The patent creates a copy of the foreign substance problem by transferring foreign substances from the resist composition to a substrate through application and removal. This copying process transforms undetectable particles in liquid into detectable defects on substrate, enabling measurement of ultra-small foreign substances
3Reliability
If exposure and thermosetting treatments are performed before inspection, then the resist composition undergoes normal processing, but foreign substances become difficult to detect due to chemical changes
Solution Approach 1:
The patent extracts the inspection step from the normal processing sequence by removing the resist composition before exposure and thermosetting treatments. This extraction allows foreign substances to be detected in their original state without chemical modification, while still enabling assessment of the resist composition's impact on substrate defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the precise measurement of ultra-small foreign substances, enhancing detection sensitivity and accuracy, thereby improving the quality and yield of semiconductor devices with nodes smaller than 10 nm.
Implementation Method 1
removal with an organic solvent without exposure or thermosetting
Data Source
AI summary
Provided is an inspection method for simply measuring an ultra-small foreign substance in a composition selected from the group consisting of an actinic ray-sensitive or radiation-sensitive composition and a thermosetting composition. In addition, provided are a method for producing a composition and a method for verifying a composition, using the inspection method. The inspection method is an inspection method for a composition selected from the group consisting of an actinic ray-sensitive or radiation-sensitive composition and a thermosetting composition, the inspection method including a step X1 for applying the composition to a substrate X to form a coating film, a step X2 for removing the coating film from the substrate X using a removal solvent including an organic solvent, and a step X3 for measuring the number of defects on the substrate X after the removal of the coating film using a defect inspection device. In a case where the composition is the actinic ray-sensitive or radiation-sensitive composition, the step X2 is applied in a state where the coating film has not been subjected to an exposure treatment by irradiation with actinic rays or radiation, and in a case where the composition is the thermosetting composition, the step X2 is applied in a state where the coating film has not been subjected to a thermosetting treatment.