Resist Pattern Aqueous Solution for Collapse and Bridge Control
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Solution Overview
Problem
Existing electronic device manufacturing processes face issues such as pattern collapse, bridge formation, uneven film thickness, solute distribution, residue after solution removal, high surface tension, handling risks, and storage stability of aqueous solutions used in resist pattern formation.
Innovation Solution
An electronic device manufacturing aqueous solution comprising a sulfonic acid derivative, a solvent, and a hydroxy derivative, which includes specific chemical formulas and concentrations, is used to reduce defects, suppress pattern collapse, and improve storage stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional aqueous solutions are used for resist pattern formation, then the manufacturing process can be completed, but pattern collapse and bridge formation occur
Solution Approach 1:
The patent changes the chemical parameters of the aqueous solution by specifying precise concentrations of sulfonic acid compounds (0.01-5 mass%), carboxylic acid compounds (0.01-5 mass%), and nonionic surfactants (0.01-5 mass%). These parameter adjustments optimize the solution's ability to prevent pattern collapse and bridge formation while maintaining manufacturing precision.
Solution Approach 2:
The patent creates a composite aqueous solution system combining multiple functional components: sulfonic acid compounds for pattern collapse prevention, carboxylic acid compounds for bridge formation suppression, and nonionic surfactants for surface tension control. This composite approach addresses multiple precision issues simultaneously.
2Reliability
If the aqueous solution contains high concentrations of solutes to improve pattern stability, then pattern collapse is suppressed, but solute distribution becomes uneven
Solution Approach 1:
The patent optimizes the concentration parameters of individual solutes while maintaining overall solution stability. By controlling each component within specific ranges (sulfonic acid 0.01-5 mass%, carboxylic acid 0.01-5 mass%, nonionic surfactant 0.01-5 mass%), the solution achieves uniform solute distribution without compromising pattern stability.
Solution Approach 2:
The patent assigns different functional roles to different solutes based on their local chemical properties. Sulfonic acid compounds target pattern collapse prevention, carboxylic acid compounds address bridge formation, and nonionic surfactants control surface tension. This localized functional assignment ensures uniform distribution while maintaining stability.
3Manufacturing precision
If the aqueous solution is used to prevent pattern collapse, then fine pattern integrity is maintained, but residue remains after solution removal
Solution Approach 1:
The patent adjusts the concentration parameters of all components to optimize the balance between pattern integrity and residue reduction. The specific ranges (0.01-5 mass% for each component) are calibrated to ensure complete solution removal while maintaining fine pattern stability throughout the manufacturing process.
Solution Approach 2:
The patent formulates a disposable aqueous solution that performs its function during the critical manufacturing window and is then completely removed. The solution is designed to be effective during use but easily removable, minimizing residue that would otherwise require additional cleaning steps.
4Ease of operation
If the surface tension of the aqueous solution is reduced to improve wetting, then pattern coverage is enhanced, but handling risk increases
Solution Approach 1:
The patent precisely controls the surface tension parameter through controlled addition of nonionic surfactants at 0.01-5 mass%. This parameter adjustment ensures adequate wetting for pattern coverage while maintaining solution stability and reducing handling risks associated with excessive surface activity.
Solution Approach 2:
The patent applies surface tension modification locally through the selective placement of nonionic surfactants that act at the solution-air interface and on the pattern surface. This localized action improves wetting without creating bulk properties that would increase handling risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces defects, prevents pattern collapse, stabilizes film thickness, and enhances storage stability while minimizing residue and handling risks, ensuring efficient resist pattern formation.
Implementation Method 1
a nonionic surfactant; a sulfonic acid compound; a carboxylic acid compound
Data Source
AI summary
An electronic device manufacturing aqueous solution includes a sulfonic acid derivative (A) having a certain structure, an aqueous solvent (B), and a hydroxy derivative (C).