Resist Composition for High-Resolution Pattern Exposure Margin
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Solution Overview
Problem
Conventional resist compositions fail to achieve sufficient resolution and exposure margin in resist patterns.
Innovation Solution
A resist composition comprising a resin with an acid-labile group, a photosensitive agent with a specific molar absorption coefficient, and an acid generator, optimized to form a film with a minimum transmittance and thickness for improved resolution and exposure margin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist compositions are used, then the resist pattern can be formed, but the resolution and exposure margin are insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the resist system by introducing a specific acid generator with controlled molar absorption coefficient (6,000 L/(mol·cm) or less at 355-375 nm) and optimizing the photosensitive agent content to 10% by mass or less. These parameter changes enable sufficient light transmittance (minimum 23%) while maintaining pattern formation capability, thereby improving resolution and exposure margin without sacrificing reliability
Solution Approach 2:
The patent creates a composite resist system combining a resin with acid-labile groups, a photosensitive agent, and a specifically selected acid generator. This composite material design allows the components to work synergistically: the acid generator produces acid upon exposure, the acid-labile groups enable solubility changes for pattern development, and the controlled photosensitive agent content optimizes both sensitivity and transmittance, achieving high resolution and exposure margin
2Use of energy by moving object
If the photosensitive agent content is increased to improve sensitivity, then exposure sensitivity improves, but the transmittance of radiation decreases
Solution Approach 1:
The patent optimizes the photosensitive agent content parameter to 10% by mass or less of the solid content, which is a critical parameter change that balances exposure sensitivity with light transmittance. This parameter optimization ensures that the resist film maintains minimum transmittance of 23% while still achieving sufficient exposure sensitivity for pattern formation
Solution Approach 2:
The acid generator acts as an intermediary substance that mediates between the photosensitive agent and the resin. By selecting an acid generator with low molar absorption coefficient, the system achieves efficient acid generation from the photosensitive agent while minimizing additional light absorption, thus maintaining high transmittance while preserving exposure sensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of high-accuracy resist patterns and plated molded articles with enhanced resolution and exposure margin.
Implementation Method 1
an acid generator (B), wherein the acid generator (B) contains a compound in which a maximum molar absorption coefficient in the wavelength range of 355 to 375 nm is 6,000 (L/(mol·cm)) or less
Implementation Method 2
a photosensitive agent (I), wherein the content of the photosensitive agent (I) is 10% by mass or less in the solid content of the resist composition
Implementation Method 3
when a film is formed from the resist composition with the film thickness used, a minimum transmittance of radiation of the film in the wavelength range of 355 to 375 nm is 23% or more
Data Source
AI summary
A resist composition contains a resin including a structural unit having an acid-labile group, a photosensitive agent, and an acid generator. The acid generator contains a compound in which a maximum molar absorption coefficient in the wavelength range of 355 to 375 nm is 6,000 (L/(mol·cm)) or less The content of the photosensitive agent is 10% by mass or less in the solid content of the resist composition. When a film is formed from the resist composition with the film thickness used, a minimum transmittance of radiation of the film in the wavelength range of 355 to 375 nm is 23% or more. Also described are a method for producing a resist pattern, and a method for producing a plated molded article.