Chemically Amplified Resist Composition for Sensitivity and Roughness

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Solution Overview

Problem

Existing resist compositions struggle to achieve high sensitivity and satisfactory roughness reducing properties simultaneously, which are essential for forming fine patterns in semiconductor and liquid crystal display element manufacturing.

Innovation Solution

A resist composition that generates an acid upon light exposure, featuring a resin component with constitutional units derived from specific compounds represented by General Formulae (a0-1) and (a0-2), which changes solubility in a developing solution due to the acid's action.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional resist composition is used, then the manufacturing process is simple, but both sensitivity and roughness reducing property cannot be sufficiently achieved

Engineering Contradiction:
Improveroughness reducing propertyVSAvoidsensitivity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent uses a composite resin system comprising multiple resin components (A1, A2, B) with different functional units. Resin A1 contains units (a01, a02) for acid diffusion control and solubility change, resin A2 contains units (a1, a10) for additional lithography characteristics, and resin B provides structural support. This composite approach enables simultaneous achievement of high sensitivity and roughness reducing property that cannot be obtained with single resin systems.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent introduces constitutional unit (a02) containing cyclic groups with -O-C(=O)- in the ring skeleton at specific positions within the resin molecule. This unit locally controls acid diffusion and provides roughness reducing effect, while other units (a01, a1, a10) provide sensitivity and lithography characteristics. The localized functional units work together to resolve the contradiction between sensitivity and roughness control.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If pattern miniaturization is pursued by shortening wavelength, then resolution improves, but sensitivity requirements become more stringent

Engineering Contradiction:
ImproveresolutionVSAvoidsensitivity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent modifies the chemical structure parameters of the resin by incorporating specific constitutional units with defined molecular weights, functional groups, and bonding characteristics. Units (a01) and (a02) have specific structural parameters that optimize acid generation and diffusion control, enabling the resist to maintain high sensitivity at shorter wavelengths while achieving fine pattern resolution.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The resin components are pre-designed with specific constitutional units that will undergo controlled chemical changes upon acid generation. The units (a01, a02) are prepared in advance with appropriate functional groups that will react to change solubility and control acid diffusion, ensuring optimal sensitivity and resolution performance when exposed to short wavelength light.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resist composition achieves high sensitivity and improved roughness reducing properties, enabling the formation of fine patterns with enhanced lithography characteristics.

Implementation Method 1

a chemically amplified resist composition containing a base material component whose solubility in a developing solution is changed due to an action of an acid and an acid generation agent component that generates an acid upon light exposure

Methodology Applied
Scientific EffectPhotochemical reaction: Photo-oxidation

Data Source

PatentUS20250102913A1Resist composition, resist pattern formation method, and compound
Publication Date: 2025.03.27 TOKYO OHKA KOGYO CO LTD
  • US20250102913A1 patent drawing
  • US20250102913A1 patent drawing
  • US20250102913A1 patent drawing

AI summary

A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) or a constitutional unit derived from a compound represented by General Formula (a0-2). In the formulae, R01 and R02 represent a hydrogen atom; L01 and L02 represent a single bond or a divalent linking group; Ar01 and Ar02 represent an aryl group substituted with iodine atoms; Xa01 represents a group which forms an alicyclic hydrocarbon group together with a carbon atom to which Ar01 is bonded; Ra02 represents a hydrocarbon group which may have a substituent; and Xa02 represents a group which forms an alicyclic hydrocarbon group together with a carbon atom to which Ra02 is bonded and a group which is bonded to Ar02 to form a condensed ring