Resistor-Embedded Circuit Board Cavity Layout for Crack-Free Pressing

The patent applies preliminary action by pre-forming cavities in the substrate before embedding the resistors. These cavities are created with precise dimensions and depths, allowing the resistor-embedded layer to be formed with controlled thickness before the pressing process. This preliminary cavity formation prevents thickness variation and cracking during subsequent pressing operations.

The patent changes the physical parameters of the embedding structure by forming cavities with specific depth and width ratios. The cavity depth is controlled to be 0.5-2 times the resistor thickness, and the width is 1.05-1.2 times the resistor width. These parameter changes enable precise thickness control while maintaining structural integrity during pressing.

The patent applies the extraction principle by removing material to form cavities in the substrate before embedding the resistors. This cavity formation process extracts the problematic filling step from the manufacturing process, replacing it with a simpler placement process where resistors are inserted into pre-formed cavities, thereby improving both ease of manufacture and embedding precision.

The patent introduces cavities as an intermediary structure between the substrate and the resistors. These cavities serve as mediators that facilitate precise resistor placement and embedding while eliminating the quality issues associated with direct filling processes. The cavities act as intermediate containers that simplify the embedding operation.