Surface Mount Resistor Thermal Management via Segmented Conductive Elements
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Solution Overview
Problem
High power resistors with high resistance values face challenges in maintaining their resistance over time due to thermal stress and require efficient heat dissipation, especially in applications like motor vehicle controls where they need to handle significant electrical power.
Innovation Solution
A resistor design featuring a resistive element thermally coupled with conductive elements via an adhesive and electrically insulated by a dielectric material, allowing for efficient heat dissipation and maintaining resistance values through the use of conductive layers and solderable layers for secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resistive element is made thinner to achieve high resistance values, then the resistance value is improved, but the thermal stress resistance deteriorates
Solution Approach 1:
The resistive element is divided into multiple segments separated by gaps, with conductive elements filling these gaps. This segmentation allows the thin resistive element to maintain high resistance while the conductive elements provide thermal management and mechanical support to reduce thermal stress.
Solution Approach 2:
The resistor uses a composite structure combining resistive material, conductive elements, adhesive material, and dielectric material. This composite approach allows the thin resistive element to be supported by the conductive elements that conduct heat away, reducing thermal stress without compromising the high resistance value.
2Power
If the resistor is designed for high power dissipation, then the power handling capability is improved, but the thermal management becomes more difficult
Solution Approach 1:
Conductive elements are introduced as intermediary components between the resistive element and the environment. These conductive elements act as heat sinks that conduct heat away from the resistive element, improving thermal management while allowing the resistor to handle higher power dissipation.
Solution Approach 2:
The patent introduces thermal management in a different dimension by adding conductive elements that extend from the resistive element. This dimensional approach allows heat to be conducted away in multiple directions, improving heat dissipation efficiency for high power applications.
3Volume of moving object
If conductive elements are placed close to each other to reduce size, then the device compactness is improved, but the electrical insulation becomes more difficult
Solution Approach 1:
Dielectric material is used as an intermediary substance between the conductive elements. This dielectric material provides electrical insulation while allowing the conductive elements to be positioned closely together, maintaining compactness without compromising insulation reliability.
4Temperature
If adhesive material is used to thermally couple conductive elements to the resistive element, then the thermal coupling is improved, but the electrical insulation between conductive elements may be compromised
Solution Approach 1:
The adhesive material is applied selectively in specific locations where thermal coupling is needed, while dielectric material is used in areas where electrical insulation is critical. This local differentiation of material properties allows simultaneous achievement of thermal coupling and electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables resistors to handle higher power ratings while maintaining resistance values, reducing the risk of thermal expansion-related failures and improving solder joint integrity, allowing for thinner resistive elements and enhanced heat dissipation.
Implementation Method 1
thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element
Implementation Method 2
The plurality of conductive elements may be electrically insulated from one another via a dielectric material
Data Source
AI summary
Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.