Resistor Component Slit Design for Resistance Control
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Solution Overview
Problem
Conventional resistor components face challenges in precisely controlling resistance values and maintaining withstand voltage characteristics due to uneven slit edges in the resistive layer and fine cracks in the protective layer caused by glass components during the sintering process.
Innovation Solution
The resistor component design includes a support substrate with a resistive layer featuring primary and secondary slits, where the primary slits are covered by a first protective layer and the secondary slit extends into the first protective layer, improving the control of resistance values and reducing cracking issues by forming slits before sintering and using a resin-based second protective layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If slits are formed in the resistive layer after sintering, then resistance value can be controlled, but the surface of the periphery of the slit becomes uneven due to fluidity and grain growth
Solution Approach 1:
The patent applies preliminary action by forming slits in the resistive layer paste before sintering rather than after. This allows the slits to be created when the material is still in a controllable paste state, avoiding the grain growth and fluidity issues that occur during sintering. The slits are then maintained through the sintering process, achieving both precise resistance control and clean slit surfaces.
2Measurement precision
If slits are formed in the protective layer after sintering, then resistance trimming is enabled, but fine cracks occur in the periphery of the slit due to glass component
Solution Approach 1:
The patent forms slits in the resistive layer before sintering, so the slit structure is established before the protective layer is applied and before glass component issues can cause cracking. This preliminary formation of slits eliminates the cracking problem that occurs when slits are formed after sintering, as the glass component cannot cause peripheral cracks when the slit structure is already stable.
Solution Approach 2:
The patent applies beforehand cushioning by having the protective layer already in place and properly bonded before any slit formation occurs. The protective layer acts as a cushioning element that prevents stress concentration and crack propagation at the slit peripheries, especially important when glass components are present in the protective layer material.
3Measurement precision
If multiple slits are formed to control resistance, then resistance precision improves, but the complexity of the structure increases
Solution Approach 1:
The patent simplifies the overall structure by forming all required slits in the resistive layer before sintering, rather than forming them sequentially after sintering. This preliminary formation approach allows for a more straightforward slit configuration design, as the slits can be planned and positioned optimally without the constraints of post-sintering processing limitations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for precise control of resistance values and enhanced withstand voltage characteristics by minimizing cracking and improving manufacturing efficiency, while maintaining the structural integrity of the resistor component.
Implementation Method 1
after applying a resistive layer paste to a support substrate and sintering the resistive layer
Implementation Method 2
diffusion and grain growth during sintering
Implementation Method 3
after sintering the protective layer formed on the resistive layer
Data Source
AI summary
A resistor component includes a support substrate, a resistive layer disposed on one surface of the support substrate, and a plurality of slits disposed in the resistive layer, each extending from one end or another end of the resistive layer opposing each other in a first direction, and spaced apart from each other in a second direction traversing the first direction. First and second internal electrodes are disposed on the support substrate and are respectively disposed on one end and another end of the resistive layer opposing each other in the second direction to be spaced apart from each other. A first protective layer is disposed on the resistive layer. The plurality of slits include a primary slit covered by the first protective layer, and a secondary slit extending in the first protective layer.