Resistor Thermal Layer Semi-Cure Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing resistors with thermally conductive layers face challenges in maintaining uniform thickness and consistency, leading to variations in heat dissipation capability and adhesive strength due to the fluidity of uncured filler materials during the manufacturing process.
Innovation Solution
A method involving the semi-curing of thermally conductive materials before applying heat and pressure to form a hardened layer between the resistive body and electrodes, allowing for precise control of the thermally conductive layer's thickness and improved bonding, thereby enhancing the flexibility and accuracy in adjusting electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uncured and unhardened filler material is disposed on the resistive element and electrodes are bent into contact with it, then the filler can be easily positioned, but the filler becomes deformed or displaced when pressure is applied due to its fluidity
Solution Approach 1:
The filler material is pre-heated to a semi-cured state before the electrodes are bent into contact with it. This preliminary heating action reduces the filler's fluidity while maintaining its workability, allowing it to retain its shape and position when pressure is applied during the bending process, thus preventing deformation and displacement
2Strength
If uncured filler material is used to bond resistive element to electrodes, then adhesion strength is provided, but heat dissipation capability varies due to non-uniform thickness
Solution Approach 1:
The filler material undergoes a controlled thermal parameter change from uncured to semi-cured state. This parameter change reduces the material's fluidity and increases its structural stability, enabling it to maintain uniform thickness during the electrode bending process. The semi-cured state provides both adequate adhesion strength and consistent thermal conductivity, ensuring reliable heat dissipation
3Reliability
If filler material is heated and pressurized while uncured, then curing is achieved, but the fluidity causes deformation and dimensional changes
Solution Approach 1:
The filler material is pre-heated to a semi-cured state before the electrodes are bent into contact with it. This preliminary heating action reduces the filler's fluidity while maintaining its workability, allowing it to retain its shape and position when pressure is applied during the bending process, thus preventing deformation and displacement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in resistors with reduced variations in thermally conductive layer thickness, improved heat dissipation, and adhesive strength, enabling more consistent and flexible adjustment of electrical resistance.
Implementation Method 1
heating the uncured, unhardened thermally conductive material to a degree sufficient to cause semi-curing and semi-hardening of the thermally conductive material
Implementation Method 2
applying heat and pressure to completely cure and harden the thermally conductive material into a cured and hardened thermally conductive layer
Data Source
AI summary
The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.