Resonant Tunneling Charge-Trap Memory for Fast Low-Power Switching

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Solution Overview

Problem

Existing nonvolatile memory devices face challenges in achieving high integration with improved operation speed and reduced power consumption.

Innovation Solution

A semiconductor device is designed with a stack structure comprising a tunnel layer, a first and second resonant tunneling layer, a charge trap layer, and a blocking layer, utilizing a resonant tunneling injection method to inject electrons efficiently, thereby enhancing switching speed and reducing power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If conventional tunneling methods are used in nonvolatile memory devices, then data storage is achieved, but operation speed is limited and power consumption is high

Engineering Contradiction:
Improveoperation speedVSAvoidpower consumption
Core Design Contradiction:
SpeedVSUse of energy by moving object

Solution Approach 1:

The patent changes the energy barrier parameter of the tunneling layer by introducing resonant tunneling layers with lower energy barriers. This allows electrons to tunnel through at lower voltages and faster speeds, simultaneously improving operation speed and reducing power consumption while maintaining data storage functionality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite structure combining conventional tunneling layers with resonant tunneling layers made of specific materials (e.g., MoS2, WS2, WSe2, MoSe2). This composite approach leverages the quantum mechanical resonant tunneling effect to achieve high-speed electron injection with reduced energy consumption

Inventive Principle:
Principle #40Composite materials

2Quantity of substance

If high integration is pursued in nonvolatile memory devices, then storage capacity increases, but operation speed and power consumption face technical limitations

Engineering Contradiction:
Improvestorage capacityVSAvoidoperation speed
Core Design Contradiction:
Quantity of substanceVSSpeed

Solution Approach 1:

The patent applies local quality by implementing resonant tunneling layers at specific critical locations within the memory device structure (between the channel pattern and electrode). This localized application of advanced materials enables high-speed operation in the data injection path while maintaining overall device integration for high storage capacity

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves high speed operation with low power consumption and improved endurance characteristics, enabling efficient electron injection and multiple level states in nonvolatile memory devices.

Implementation Method 1

at least one resonant tunneling layer disposed between the tunnel layer and the blocking layer, and including a material having a lower energy barrier than the tunnel layer and the blocking layer

Methodology Applied
Scientific EffectResonant tunneling: Resonance

Data Source

PatentUS20250248039A1Semiconductor device including resonant tunneling layer
Publication Date: 2025.07.31 SK HYNIX INC
  • US20250248039A1 patent drawing
  • US20250248039A1 patent drawing
  • US20250248039A1 patent drawing

AI summary

A semiconductor device may include an electrode over a channel pattern. An information storage pattern may be disposed between the channel pattern and the electrode. The information storage pattern may include a tunnel layer adjacent to the channel pattern; a blocking layer adjacent to the electrode; a charge trap layer between the tunnel layer and the blocking layer; a first resonant tunneling layer disposed between the tunnel layer and the charge trap layer, and including a material having a lower energy barrier than the tunnel layer; and a second resonant tunneling layer disposed between the charge trap layer and the blocking layer, and including a material having a lower energy barrier than the charge trap layer.