Resonator Device Bump Integration for Compact Clock Generation
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Solution Overview
Problem
Existing resonator devices face challenges in size reduction and performance degradation due to parasitic resistance and capacitance, especially when multiple resonators are integrated, making it difficult to achieve compact designs while maintaining high precision clock signals.
Innovation Solution
The resonator device incorporates multiple resonators and oscillation circuits with bump connections and wire-bonding, allowing for compact integration by overlapping resonators with oscillation circuits and using bonding wires to reduce parasitic effects, while also supporting resonators at single points to minimize thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple resonators are integrated on a chip board, then device functionality is improved, but device size and parasitic effects increase
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking, placing resonators at different heights (first resonator on the board surface, second resonator above it) to achieve compact integration while maintaining functionality
Solution Approach 2:
The patent embeds the first resonator within the structural footprint of the second resonator, allowing one component to be nested inside the spatial envelope of another, thereby reducing overall device area
2Ease of manufacture
If resonators are connected with long connection paths, then ease of connection is improved, but parasitic resistance and capacitance increase causing performance degradation
Solution Approach 1:
The patent uses vertical bump connections to bridge resonators at different heights, creating short three-dimensional connection paths that reduce parasitic effects while maintaining manufacturing feasibility through standard bump bonding processes
Solution Approach 2:
The patent introduces bump connections as intermediary elements that provide low-parasitic electrical pathways between resonators and oscillation circuits, mediating the connection while minimizing harmful electrical effects
3Adaptability or versatility
If resonators are mounted on separate packages, then connection flexibility is improved, but device size increases and integration density decreases
Solution Approach 1:
The patent merges multiple resonators and oscillation circuits into a single integrated package structure, combining components that were traditionally separate into one unified device to reduce overall volume while maintaining connection flexibility through internal bump wiring
4Device complexity
If resonators are disposed side by side, then connection paths are simplified, but device area increases and thermal stress distribution worsens
Solution Approach 1:
The patent arranges resonators in a vertical stack rather than horizontal side-by-side configuration, reducing device footprint area while managing thermal stress through vertical separation and independent mounting positions at different heights
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact resonator device with improved precision and reduced thermal stress, achieving high-accuracy clock signal generation and frequency correction, suitable for various processing tasks including time-digital conversion.
Implementation Method 1
an oscillation circuit unit (101) that oscillates a piezoelectric resonator (XTAL1)
Data Source
AI summary
A resonator device includes first and second resonators and an integrated circuit. The integrated circuit includes first and second oscillation circuits that oscillate first and second resonators, first and second terminals connected to the first oscillation circuit, and third and fourth terminals connected to the second oscillation circuit. The first terminal of the integrated circuit and one electrode of the first resonator are connected to each other via a bump. The third terminal and one electrode of the second resonator are connected to each other via a bump. In a plan view, at least a portion of the first resonator overlaps the first oscillation circuit and at least a portion of the second resonator overlaps the second oscillation circuit.