Carrier Head Retainer Ring Grooves for CMP Planarity
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Solution Overview
Problem
The increasing complexity of semiconductor device manufacturing, with multilayered structures and significant surface curvatures, leads to non-planarization issues that cause defocus in photolithography processes, necessitating effective surface planarization techniques like chemical mechanical polishing (CMP).
Innovation Solution
A substrate carrier head with a retainer ring featuring weight adjusting grooves and seal rings, coupled with a carrier body, to enhance polishing efficiency and maintain substrate planarity during CMP processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the retainer ring weight is adjusted to improve polishing uniformity, then the polishing precision is improved, but the device complexity increases due to additional adjustment mechanisms
Solution Approach 1:
The patent applies parameter changes by modifying the weight of the retainer ring through grooves of varying depths. By changing the physical parameter (weight) through simple geometric modifications rather than complex mechanisms, the polishing uniformity is improved while avoiding increased device complexity. The groove depth serves as the adjustable parameter that directly influences the retainer ring's effect on the polishing process.
2Manufacturing precision
If multiple grooves are added to the retainer ring for weight adjustment, then the polishing precision is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent uses parameter changes by varying the depth, width, or number of grooves to adjust the retainer ring weight. This approach allows precise control over polishing parameters through simple dimensional modifications that can be integrated into existing manufacturing processes, avoiding the need for complex assembly or adjustment mechanisms.
Solution Approach 2:
The retainer ring is segmented into sections with different groove depths or patterns. This segmentation allows independent adjustment of different regions of the retainer ring to compensate for specific polishing non-uniformities, achieving high precision while maintaining manufacturing simplicity through modular design.
3Manufacturing precision
If the retainer ring structure is modified to improve polishing performance, then the polishing quality is improved, but the structural stability may be compromised
Solution Approach 1:
The patent applies local quality by creating grooves only in specific regions of the retainer ring where weight adjustment is needed, rather than uniformly modifying the entire structure. This allows precise control over polishing performance while maintaining the structural integrity of the overall retainer ring design.
Solution Approach 2:
The groove dimensions (depth, width, spacing) are carefully controlled as parameters to achieve the desired weight adjustment without compromising structural strength. By optimizing these parameters, the patent balances polishing performance improvement with maintenance of retainer ring structural stability.
Data Source
AI summary
Provided are carrier heads that include a carrier body; and a retainer ring coupled to the carrier body. A weight adjusting groove recessed into the retainer ring by a predetermined depth is disposed at an upper surface of the retainer ring.