Retractable Shielding Unit for Multi-Size Wafer Plasma Processing
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Solution Overview
Problem
Conventional plasma tools are often incompatible with multiple wafer sizes, requiring separate tools for each size, which increases production costs and maintenance time due to exposure of chuck components to corrosive ionized gases, leading to frequent replacements and downtime.
Innovation Solution
A plasma tool with a shielding unit that can adjust its central opening to accommodate different wafer sizes, using retractable plates made of resistant materials to protect the chuck from ionized etchant gas atoms, allowing for processing of various wafer diameters within the same tool.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single plasma tool is used to process multiple wafer sizes, then device versatility and productivity are improved, but the chuck components are exposed to corrosive ionized gases causing damage and requiring frequent maintenance
Solution Approach 1:
The shielding unit is divided into multiple retractable plates that can be independently positioned. Each plate can be extended or retracted to provide selective protection to different regions of the chuck, allowing the system to adapt to various wafer sizes while protecting only the necessary portions of the chuck from plasma exposure.
Solution Approach 2:
The retractable plates serve as an intermediary barrier between the plasma source and the chuck. These plates can be positioned to block corrosive ionized gases from reaching the chuck surface, thereby protecting the chuck components while still allowing plasma processing to occur on the wafer.
2Reliability
If separate plasma tools are used for each wafer size, then chuck component protection is improved, but production cost and maintenance time increase
Solution Approach 1:
The plasma tool is designed with a universal chuck that can accommodate multiple wafer sizes through the addition of adapter rings. The retractable plates provide universal protection capability across different wafer sizes, eliminating the need for multiple dedicated tools while maintaining chuck protection.
Solution Approach 2:
The retractable plates can be dynamically adjusted between extended and retracted positions based on the specific processing requirements. This dynamic adjustment allows the same tool to optimize protection for different wafer sizes without requiring physical reconfiguration or replacement of components.
3Reliability
If retractable plates are extended to protect the chuck, then chuck protection from ionized gases is improved, but plasma source to substrate exposure is reduced
Solution Approach 1:
The retractable plates provide localized protection only to the specific regions of the chuck that require protection from plasma exposure. The plates can be positioned to shield the chuck periphery while leaving the central processing area open, ensuring that plasma processing efficiency is maintained in the substrate area while protecting the chuck components.
Solution Approach 2:
The shielding is applied partially rather than completely - only the necessary portions of the chuck are protected by the retractable plates. This partial shielding approach provides sufficient protection to prevent chuck damage while minimizing interference with the plasma processing of the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient processing of wafers of different sizes using a single tool, reducing production costs and maintenance time by minimizing damage to the chuck and extending tool functionality.
Implementation Method 1
positioning a shield between a plasma source and the chuck. The shield covers a peripheral region of the chuck
Data Source
AI summary
In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber. The process tool further includes a shielding unit with a central opening. The shielding unit is disposed in the chamber over the chuck.