Reusable Transfer Mold Layout for Accurate Micro-LED Placement

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Solution Overview

Problem

Current methods for manufacturing high-resolution display apparatuses using micro-light-emitting devices are inefficient in transferring and repairing micro-sized light-emitting diodes onto desired pixel locations, lacking a cost-effective and high-yield solution for multiple uses.

Innovation Solution

A multi-use transfer mold with grooves containing transfer areas and preliminary areas allows for the repeated transfer of micro-light-emitting devices onto driving substrates, enabling efficient alignment and bonding of devices across multiple substrates, reducing manufacturing costs and increasing yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a conventional transfer mold is used for manufacturing high-resolution display apparatuses, then the transfer process can be performed, but the mold can only be used once and requires replacement for each new batch, increasing manufacturing costs and reducing productivity

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidreusability of transfer mold
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The transfer mold is designed with multiple grooves that can accommodate different types of micro-light-emitting devices (minileds, micro-LEDs, micro-b LEDs) and transfer them to different substrate types (flexible substrates, rigid substrates, OLED substrates). This multi-functional design allows a single mold to be reused across multiple production batches and product types, eliminating the need to replace molds for each new manufacturing run.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If micro-light-emitting devices are transferred onto driving substrates, then pixel locations can be populated, but transfer errors and misalignment occur, requiring repair processes that reduce manufacturing yield

Engineering Contradiction:
Improvealignment accuracyVSAvoidmanufacturing yield
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The grooves in the transfer mold are pre-configured with precise dimensions and positions corresponding to the exact pixel locations on the driving substrates. The micro-light-emitting devices are pre-positioned within these grooves before transfer, ensuring accurate alignment is achieved automatically during the transfer process without requiring post-transfer adjustment or repair operations.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If a single-use transfer mold is used, then each batch can be manufactured, but the cost per batch increases due to continuous mold replacement and setup

Engineering Contradiction:
Improvemanufacturing costVSAvoidbatch production efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The transfer mold is designed as a reusable component that maintains its structural integrity and functional precision after multiple transfer operations. Instead of being discarded after a single use, the mold is recovered and reused for subsequent production batches, thereby amortizing the initial manufacturing cost across multiple batches and reducing the cost per unit produced.

Inventive Principle:
Principle #34Discarding and recovering

Data Source

PatentEP4084094B1Multi-use transfer mold and method of manufacturing display apparatus
Publication Date: 2023.11.22 SAMSUNG ELECTRONICS CO LTD
  • EP4084094B1 patent drawingFigure 1
  • EP4084094B1 patent drawingFigure 2
  • EP4084094B1 patent drawingFigure 3

AI summary

A multi-use transfer mold and a method of manufacturing a display apparatus are provided. The multi-use transfer mold includes a transfer substrate and a plurality of grooves provided in the transfer substrate, wherein each of the grooves includes a transfer area for accommodating a transfer micro-light-emitting device and a preliminary area for accommodating a preliminary micro-light-emitting device, wherein the preliminary area is connected to the transfer area.