Sputtering Target Bonding With Reverse Sliding for Low Defect Areas
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Solution Overview
Problem
The conventional method of bonding a sputtering target is insufficient, leading to a low bonding rate and a large maximum defect area, which results in the target material peeling off during sputtering.
Innovation Solution
An improved method of bonding a sputtering target involves applying a bonding material to a backing plate, sliding the target material in a first direction to cover the bonding region, and then reversing it in a second direction to ensure complete bonding, resulting in a bonding rate of 97% or more and a maximum defect area of 0.6% or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the conventional bonding method is used, then the bonding process is simple, but the bonding rate is low and the maximum defect area is large
Solution Approach 1:
The bonding material is applied to the bonding region before the target material is placed, and the target material is then slid in a first direction to distribute the bonding material evenly. This preliminary distribution action ensures that when the target material is reversed in the second direction, the bonding rate is significantly improved with minimal defects.
2Reliability
If the conventional bonding method is used, then the bonding process is fast, but the target material peels off during sputtering
Solution Approach 1:
The bonding process continues with the target material being slid in the first direction and then reversed in the second direction, ensuring continuous contact between the target material and bonding material throughout the bonding region. This continuous action ensures complete bonding coverage, preventing peeling during sputtering while maintaining efficient bonding time.
3Manufacturing precision
If the target material is bonded with insufficient bonding material coverage, then the bonding process is simple, but the maximum defect area is large
Solution Approach 1:
The target material is dynamically moved in a first direction and then reversed in a second direction during the bonding process. This dynamic movement ensures that the bonding material is evenly distributed across the entire bonding region, reducing the maximum defect area to 0.6% or less while maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves the bonding rate and reduces the maximum defect area, resulting in a sputtering target where the target material is hardly peeled off during sputtering.
Implementation Method 1
a target material bonded via a bonding material to a bonding region of the backing plate
Data Source
AI summary
A sputtering target comprising:a backing plate; anda target material bonded via a bonding material to a bonding region of the backing plate, whereina bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and whereina maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region.The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.