Re-workable Adhesive for Electronic Devices Using Hot-melt and Pressure-sensitive Blend
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Solution Overview
Problem
The miniaturization of personal electronic devices poses challenges in securely attaching components due to limited space, making it difficult to use traditional fasteners like screws or clips, especially in narrow bezels of devices such as laptops and smartphones, where components like liquid crystal panels require secure and re-workable adhesion.
Innovation Solution
The use of a re-workable adhesive comprising a combination of hot-melt and pressure-sensitive adhesives, where the hot-melt adhesive has a reduced bond strength at elevated temperatures, allowing for secure attachment and subsequent removal and repositioning of components without additional adhesive, occupying less space than traditional fasteners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional fasteners like screws or clips are used to securely attach components, then the attachment strength is improved, but the space occupation increases and the device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical fasteners (screws, clips) with an adhesive system that uses chemical bonding instead of mechanical interlocking. The adhesive layer applies bonding force through adhesion and cohesion mechanisms, eliminating the need for physical fasteners and reducing space occupation in narrow bezel areas
Solution Approach 2:
The patent employs a composite adhesive system combining hot-melt adhesive and pressure-sensitive adhesive in specific weight ratios. This composite formulation achieves optimal balance between attachment strength and re-workability, providing strong bonding during assembly while enabling controlled removal at elevated temperatures
2Strength
If traditional fasteners like screws or clips are used to securely attach components, then the attachment strength is improved, but the device complexity increases
Solution Approach 1:
The adhesive system replaces complex mechanical fastening mechanisms with a simpler chemical bonding approach. This eliminates the need for holes, threads, clips, or other mechanical structures, thereby reducing device complexity while maintaining attachment strength
Solution Approach 2:
The patent merges the functions of multiple components (adhesive layer, release films, hot-melt and pressure-sensitive adhesives) into a single integrated attachment system. This consolidation simplifies the overall device structure by eliminating the need for separate fasteners, mounting brackets, or alignment mechanisms
3Ease of repair
If hot-melt adhesive is used to provide reduced bond strength at elevated temperature for re-workability, then the re-workability is improved, but the attachment strength at normal temperature may be compromised
Solution Approach 1:
The patent creates a composite adhesive material combining hot-melt adhesive (providing re-workability through temperature-dependent bond strength reduction) and pressure-sensitive adhesive (providing strong initial attachment). The specific weight ratio optimization ensures that the pressure-sensitive component compensates for any potential strength loss while the hot-melt component enables controlled removal at elevated temperatures
Solution Approach 2:
The patent utilizes temperature as a controllable parameter to modify adhesive properties. At normal operating temperatures, the adhesive maintains strong bonding characteristics. At elevated temperatures (e.g., during repair or repositioning), the hot-melt component's bond strength reduces, enabling easy removal and repositioning without compromising normal-use attachment strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure attachment and repositioning of electronic device components, such as liquid crystal displays, within tight spaces, facilitating assembly, repair, and replacement while minimizing space occupation and enhancing durability.
Implementation Method 1
the hot-melt adhesive has a reduced bond strength at an elevated temperature
Implementation Method 2
a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive
Data Source
AI summary
The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.