RF Antenna Array 3D Imaging for Internal Structure Modeling
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Solution Overview
Problem
Current 3D modeling technologies are limited in capturing the internal structure of objects, as they primarily focus on external surfaces, and existing RF systems for 3D imaging are plane-based, failing to provide full 3D models, especially for opaque objects.
Innovation Solution
A system utilizing a wideband electromagnetic transducer array with RF antennas, including a transmitter and receiver unit, and a processing unit to construct a 3D image of objects by measuring RF signals affected by the object, allowing for the identification of dielectric properties and internal structure representation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical units or laser devices are used for 3D imaging, then external surface imaging is achieved, but internal structure imaging is lost
Solution Approach 1:
The patent replaces optical imaging systems with electromagnetic (RF) imaging systems. The RF system uses electromagnetic waves to penetrate opaque objects and capture internal structures, substituting the mechanical/optical approach that only surfaces external geometry. This allows simultaneous acquisition of both external and internal object characteristics through dielectric property measurements.
Solution Approach 2:
The patent changes the imaging parameter from optical reflection (surface-only) to electromagnetic wave interaction with dielectric properties. By measuring how RF signals interact with the object's dielectric characteristics, the system can infer both external shape and internal structure, transforming the measurement approach to access previously invisible internal features.
2Ease of manufacture
If planar RF arrays are used for imaging, then 2D imaging is achieved, but full 3D modeling is limited
Solution Approach 1:
The patent transitions from planar (2D) RF array imaging to three-dimensional (3D) electromagnetic transducer array imaging. By distributing transducers in a volumetric arrangement around the object rather than in a flat plane, the system captures electromagnetic interactions from multiple spatial dimensions, enabling complete 3D reconstruction including internal structures that planar arrays cannot resolve.
3Measurement precision
If laser devices are used for distance measurement, then 3D contour imaging is achieved, but device cost increases
Solution Approach 1:
The patent employs relatively low-cost RF transducers and antennas instead of expensive laser ranging devices. While individual RF components are simpler and less costly than precision laser systems, their collective arrangement in a three-dimensional array provides comparable or superior measurement capabilities for 3D modeling, significantly reducing overall system cost while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate 3D modeling of both external and internal parts of objects, including those with opaque materials, providing comprehensive mechanical models suitable for applications like 3D printing and non-destructive testing.
Implementation Method 1
a transmitter unit for applying RF (radio-frequency) signals to said electromagnetic transducer array
Implementation Method 2
process said RF data to identify the dielectric properties of said object
Data Source
AI summary
A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio-frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object.