Ultrasonic/Sonic/Infrasonic Diagnostics TRIZ Cases
- RF Antenna Array 3D Imaging for Internal Structure Modeling
Wideband RF antenna arrays capture dielectric properties and internal geometry, enabling full 3D models of opaque objects.
- CMUT-CMOS Wafer Bonding Without TSVs or Thermal IC Damage
Two-step wafer bonding forms sealed CMUT cavities, then joins them to CMOS at low temperature to avoid TSVs and protect ICs.
- Wireless Foot Switch Signal Monitoring for Medical Device Control
Signal strength and noise monitoring warns of wireless foot switch interference before medical device control is disrupted.
- Wireless Foot Switch Signal Monitoring for Medical Device Control
Signal strength and noise monitoring warns of wireless interference in medical foot switch control before communication fails.
- pMUT Top Electrode Layout for Acoustic Pressure and Capacitance
Non-uniform top electrode density aligned with anti-nodal points boosts pMUT acoustic pressure while limiting capacitance growth.
- CMUT Electrode Contact Resistance for Collapse-Mode Reliability
High-resistance electrode contact lets CMUTs run in collapse mode with less shorting and dielectric charging, improving acoustic output and reliability.