RF Circuit Placement in Semiconductor Arrays
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Solution Overview
Problem
RF circuits in semiconductor devices occupy a large percentage of the surface area, limiting the reduction in size of integrated circuits due to their size and the need for dedicated areas, which hinders the scaling of other components like logic circuitry and memory.
Innovation Solution
RF circuits or portions thereof are integrated into active circuit or standard cell arrays, utilizing unused areas within the arrays, thereby reducing the need for dedicated space and allowing for more efficient use of the semiconductor device surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If RF circuits are placed in dedicated areas on the die, then RF circuit functionality is ensured, but the overall die area increases and scaling of other components is limited
Solution Approach 1:
The patent merges RF circuits with standard cell arrays by placing RF circuit elements (inductors, capacitors, transistors) within the same array structure as digital standard cells. This integration allows RF functionality to be achieved without separate dedicated areas, thereby reducing overall die area while maintaining RF circuit performance through proper element placement and configuration within the unified array.
Solution Approach 2:
The standard cell array is designed to serve multiple functions simultaneously: it houses both digital logic standard cells and RF circuit elements. The array structure becomes a universal platform that supports diverse circuit types, eliminating the need for separate dedicated RF regions and enabling more efficient space utilization on the die.
2Reliability
If RF circuits occupy large surface area, then RF performance is maintained, but the reduction in IC size is limited
Solution Approach 1:
The patent applies local quality by strategically placing RF circuit elements in specific locations within the standard cell array where they can achieve optimal RF performance with minimal area. By carefully selecting positions for inductors, capacitors, and transistors within the array and configuring their dimensions locally, the design maintains RF performance while minimizing the area occupied, thus enabling better IC scaling.
Data Source
AI summary
Semiconductor devices, methods of manufacturing thereof, and methods of arranging circuit components of an integrated circuit are disclosed. In one embodiment, a semiconductor device includes an array of a plurality of devices arranged in a plurality of rows. At least one radio frequency (RF) circuit or a portion thereof is disposed in at least one of the plurality of rows of the array of the plurality of devices.