RF Device Electrostatic Protection Module Integration
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Solution Overview
Problem
Existing radio-frequency devices face challenges in effectively protecting against surge energy, such as electrostatic discharge, while maintaining a compact form factor, as traditional electrostatic protection components increase cost and volume, thereby inefficiently utilizing circuit board space.
Innovation Solution
A radio-frequency device with a first electrostatic protection module comprising a wire layer, cell layer, grounding layer, and dielectric layers, where the vertical projection of the wire layer overlaps with the cell layer, providing enhanced surge suppression and integrity for high-frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrostatic protection components are arranged separately, then surge protection function is provided, but cost and overall volume increase
Solution Approach 1:
The patent combines the electrostatic protection function with the existing transmission line structure by integrating the first wire layer (providing protection) with the signal transmission line. This merging eliminates the need for separate protection components, reducing both volume and cost while maintaining surge protection capability.
Solution Approach 2:
The first wire layer serves dual functions: it acts as both a signal transmission path and an electrostatic protection element. By making the transmission line structure multi-functional, the patent eliminates dedicated protection components, thereby reducing overall device volume and cost.
2Reliability
If traditional electrostatic protection components are arranged separately, then surge protection function is provided, but cost increases
Solution Approach 1:
The patent merges the electrostatic protection function into the transmission line structure itself. The first wire layer and first cell layer work together to provide protection while forming part of the signal path, eliminating the need for separate protection components and reducing manufacturing cost.
Solution Approach 2:
By designing the transmission line to simultaneously provide signal transmission and electrostatic protection through its layered structure, the patent eliminates the need for additional protection components, thereby reducing bill of materials cost and simplifying manufacturing.
3Reliability
If traditional electrostatic protection components are arranged separately, then surge protection function is provided, but space on circuit board cannot be effectively utilized
Solution Approach 1:
The patent combines the protection function with the transmission line occupying the same circuit board space. The first wire layer and first cell layer are integrated within the existing transmission line footprint, eliminating additional space requirements and improving overall space utilization.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking multiple layers (first wire layer, first cell layer, first grounding layer, and dielectric layers) to provide protection functionality within the same planar footprint, thereby improving circuit board space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves surge suppression and balances the integrity of high-frequency signals, reducing the overall size of the electrostatic protection module while maintaining effective protection against electrostatic discharge.
Implementation Method 1
protected from an impact of surge energy such as electrostatic discharge (ESD)
Data Source
AI summary
A radio-frequency device and a radio-frequency component thereof are provided. The radio-frequency component includes a signal transmission line and a first electrostatic protection module coupled to the signal transmission line. The first electrostatic protection module includes a first wire layer including a first wire coupled to the signal transmission line, a first cell layer disposed corresponding to the first wire layer and including a first conductive body and a plurality of first non-conductive portions, a first grounding layer coupled to the first wire layer and the first cell layer, a first dielectric layer disposed between the first wire layer and the first cell layer, and a second dielectric layer disposed between the first cell layer and the first grounding layer. A vertical projection of the first conductive line on the first dielectric layer at least partially overlaps with that of the first cell layer on the same.


