3D-Printed RF Gas Breaks for Impedance and Flow Consistency

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Solution Overview

Problem

Conventional RF gas breaks in semiconductor processing systems face challenges in impedance matching and gas flow consistency due to manufacturing variability, limiting precision and control over etch rates in plasma processing chambers.

Innovation Solution

The use of additive manufacturing techniques to fabricate RF gas breaks with complex gas flow geometries and internal structures provides improved impedance matching and design flexibility, reducing variability and enhancing control over gas conductance and etch rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional manufacturing techniques are used to fabricate RF gas breaks, then manufacturing simplicity is maintained, but manufacturing precision and gas flow consistency deteriorate due to variability

Engineering Contradiction:
Improvegas flow consistencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the manufacturing method from conventional techniques (machining, molding) to additive manufacturing, fundamentally altering the production parameter to achieve complex internal geometries and consistent gas flow paths that were previously impossible to manufacture with high precision

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

Additive manufacturing enables the creation of three-dimensional complex internal structures and optimized gas flow paths within the RF gas break that cannot be achieved with traditional two-dimensional machining or molding approaches, allowing precise control over gas conductance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If RF gas breaks are manufactured with complex gas flow geometries, then gas conductance control is improved, but manufacturing capability requirements increase

Engineering Contradiction:
Improvegas flow geometry precisionVSAvoidmanufacturability
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The manufacturing parameter is changed from conventional methods to additive manufacturing, which can directly fabricate complex three-dimensional gas flow geometries and internal structures without the limitations of traditional machining or molding capabilities

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the ability of additive manufacturing to create controlled porous or lattice structures within the RF gas break, enabling optimized gas flow paths and conductance control through three-dimensional infill patterns that were impossible with conventional manufacturing

Inventive Principle:
Principle #31Porous materials

3Manufacturing precision

If additive manufacturing is used to fabricate RF gas breaks, then manufacturing precision and design flexibility are improved, but manufacturing cost may increase

Engineering Contradiction:
Improveimpedance matching precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent changes the manufacturing approach to additive manufacturing, which provides superior precision for impedance matching and gas flow characteristics, enabling consistent performance across multiple components despite potentially higher per-unit manufacturing costs

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Additive manufacturing of RF gas breaks results in consistent gas flow characteristics across multiple components, improving etch rate control and precision in semiconductor processing, reducing material usage while maintaining structural integrity.

Implementation Method 1

The RF gas break is configured to provide a mixing of different component process gases and to provide an electromagnetic barrier that isolates a grounded input gas line from an electrically charged gas delivery nozzle

Methodology Applied
Scientific EffectElectromagnetic barrier: Faraday Cage

Implementation Method 2

a plasma source configured to direct RF energy into the chamber

Methodology Applied
Scientific EffectRadio frequency plasma generation: Electromagnetic Induction

Implementation Method 3

an etching gas mixture flows through a gas delivery nozzle to form a plasma in a processing region of the chamber

Methodology Applied
Scientific EffectPlasma formation: Plasma

Data Source

PatentUS20240339302A1Electrical break for substrate processing systems
Publication Date: 2024.10.10 APPLIED MATERIALS INC
  • US20240339302A1 patent drawing
  • US20240339302A1 patent drawing
  • US20240339302A1 patent drawing

AI summary

Systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. The apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. The gas break can be formed using additive manufacturing.