RF Inductor Shielding Structure for Q-Factor Improvement
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Solution Overview
Problem
Current radiofrequency devices face challenges in enhancing the quality factor (Q-factor) of their inductor structures, which affects energy efficiency, due to ongoing design and process limitations.
Innovation Solution
A radiofrequency device design that incorporates a shielding structure under the inductor, covered by a mask pattern, to reduce energy loss and increase the Q-factor by blocking electric field lines and reducing coupling capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a shielding structure is placed under the inductor structure, then energy loss is reduced and Q-factor is improved, but device complexity increases due to additional structural layers
Solution Approach 1:
The mask pattern is integrated within the existing device structure, nested between the inductor structure and the semiconductor substrate. This nesting approach allows the shielding function to be incorporated without adding external components, thereby reducing energy loss while minimizing increases in device complexity.
Solution Approach 2:
The mask pattern serves as an intermediary structure between the inductor structure and the semiconductor substrate. It mediates the electromagnetic field interaction by providing shielding functionality through its conductive nature, reducing energy loss while maintaining a relatively simple implementation as a conductive layer.
2Loss of energy
If the top surface of the shielding structure is completely covered by the mask pattern, then coupling capacitance is reduced and Q-factor is improved, but manufacturing precision requirements increase
Solution Approach 1:
The mask pattern is designed with specific local coverage characteristics, completely covering the top surface of the shielding structure where it is most needed for reducing coupling capacitance. This localized quality approach focuses the shielding effect on the critical area between the inductor structure and the semiconductor substrate, improving energy efficiency while managing manufacturing precision requirements through targeted rather than universal coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the Q-factor of the inductor structure, leading to improved energy efficiency and device performance by minimizing energy loss through the use of a mask pattern covering the shielding structure.
Implementation Method 1
A first portion of the mask pattern is disposed on the shielding structure and directly contacts the shielding structure... blocking electric field lines and reducing coupling capacitance
Data Source
AI summary
A radiofrequency device includes a semiconductor substrate, an inductor structure, a shielding structure, and a mask pattern. The semiconductor substrate includes a first region and a second region. The inductor structure is disposed on the first region of the semiconductor substrate. The shielding structure is disposed on the first region of the semiconductor substrate and located between the inductor structure and the semiconductor substrate in a vertical direction. The mask pattern is disposed on the semiconductor substrate. A first portion of the mask pattern is disposed on the shielding structure and directly contacts the shielding structure, and a top surface of the shielding structure is completely covered by the first portion of the mask pattern.