RF Module 3D Packaging for Multi-Band Isolation and Low Loss
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Solution Overview
Problem
The challenge is to design a radio frequency module that can simultaneously use unlicensed bands above 5 GHz and licensed bands below 5 GHz without increasing size, while minimizing signal quality deterioration due to increased signal line lengths and interference.
Innovation Solution
The solution involves a radio frequency module with both unlicensed and licensed band amplifiers housed in the same package, utilizing low noise amplifiers, power amplifiers, filters, and switches to manage signal transfer efficiently, reducing signal line lengths and optimizing interference properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between the unlicensed band transfer circuit and licensed band transfer circuit is increased to ensure isolation, then interference between frequency bands is reduced, but the signal line length increases leading to increased transfer loss and increased module size
Solution Approach 1:
The patent applies three-dimensional packaging technology to arrange the unlicensed band transfer circuit and licensed band transfer circuit in different spatial layers within the same package. This vertical stacking approach allows the circuits to be physically separated in the Z-direction (height dimension) while maintaining a compact footprint in the XY-plane, thereby achieving frequency band isolation without increasing the overall module size. The signal lines are also routed through three-dimensional paths to minimize interference while keeping the module compact.
2Object-affected harmful factors
If the distance between the unlicensed band transfer circuit and licensed band transfer circuit is increased to ensure isolation, then interference between frequency bands is reduced, but the signal line length increases leading to increased transfer loss
Solution Approach 1:
By utilizing three-dimensional packaging, the patent enables signal lines to be routed vertically through different layers rather than horizontally across the substrate. This reduces the effective signal path length while maintaining adequate isolation distance between frequency band circuits. The vertical interconnects through the package structure provide shorter signal paths compared to traditional planar routing, thereby reducing transfer loss while ensuring frequency band isolation.
3Volume of moving object
If the unlicensed band transfer circuit and licensed band transfer circuit are arranged close to each other for miniaturization, then module size is reduced, but isolation between frequency bands cannot be ensured
Solution Approach 1:
The patent employs three-dimensional packaging to stack the unlicensed band transfer circuit and licensed band transfer circuit in different vertical layers within a compact package. This approach maintains a small module footprint by utilizing the Z-dimension for circuit separation, achieving miniaturization while ensuring adequate isolation between frequency bands through vertical spacing and shielding structures implemented in the package design.
Solution Approach 2:
The patent implements a nested packaging structure where multiple transfer circuits for different frequency bands are integrated within a single package housing. The unlicensed band and licensed band transfer circuits are nested in different layers of the same package, sharing common packaging structures while maintaining physical separation. This nesting approach enables miniaturization by consolidating multiple circuits into a single compact unit while preserving frequency band isolation through layered arrangement and internal shielding.
Data Source
AI summary
A radio frequency module includes: a first terminal to which a signal of a first frequency band is inputted, the first frequency band being at least a portion of an unlicensed band higher than or equal to 5 GHz; a second terminal to which a signal of a second frequency band is inputted, the second frequency band being at least a portion of a licensed band lower than 5 GHz; a first amplifier configured to amplify a signal of the first frequency band inputted to the first terminal; and a second amplifier configured to amplify a signal of the second frequency band inputted to the second terminal. In the radio frequency module, the first amplifier and the second amplifier are disposed in one package.