Double-Sided RF Module Layout for Secure Motherboard Fixation
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Solution Overview
Problem
Radio-frequency modules with increased complexity due to multiband operation often face inadequate fixation to mother substrates, particularly when components are mounted on the back surface.
Innovation Solution
A radio-frequency module design with a module substrate having opposing major surfaces, where electronic components and external connection terminals are disposed on both sides, and a resin member covers at least one surface, ensuring secure coupling through overlapping electrodes and terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are mounted on both sides of the module substrate to reduce size, then the volume of the radio-frequency module is reduced, but the fixation reliability to the mother substrate deteriorates
Solution Approach 1:
The patent transitions from single-sided to double-sided mounting, utilizing the z-dimension (thickness direction) to mount components on both the first and second major surfaces of the module substrate. This dimensional expansion allows component placement in three-dimensional space, reducing the footprint area while maintaining compact form factor.
Solution Approach 2:
The module substrate is divided into two functional surfaces: the first major surface for mounting certain components and the second major surface for mounting other components. This segmentation allows independent optimization of each surface's component layout and facilitates separate bonding pad arrangements for reliable fixation.
2Device complexity
If components are mounted on the back surface of the module substrate, then the integration density is improved, but the fixation stability to another object deteriorates
Solution Approach 1:
Different regions of the module substrate are assigned different functions: the first major surface area is optimized for component mounting with appropriate bonding pads, while the second major surface area is optimized for fixation with dedicated fixation bonding pads. This local quality differentiation ensures each surface performs its specific function effectively.
Solution Approach 2:
The module substrate serves multiple functions simultaneously: it acts as a mechanical support structure, an electrical interconnection platform, and a fixation interface. The substrate integrates component mounting, signal transmission, and mechanical attachment functions within a single component.
3Adaptability or versatility
If the number of components is increased for multiband operation, then the functionality is improved, but the fixation adequacy to the mother substrate deteriorates
Solution Approach 1:
Multiple functional elements are nested within the module substrate structure: components are mounted on surfaces, bonding pads are embedded in the substrate, and fixation structures are integrated into the substrate architecture. This nesting allows high component density while maintaining structural integrity for reliable fixation.
Data Source
AI summary
A radio-frequency module including a module substrate, a plurality of electronic components, a plurality of external connection terminals, a resin member, and a plurality of electrodes. The module substrate has first and second major surfaces that are opposite to each other. The plurality of electronic components are disposed at the major surface and at the major surface. The external connection terminals are disposed at the major surface and include a first external connection terminal. The resin member is disposed at the major surface. The plurality of electrodes are disposed at the major surface and coupled to the plurality of external connection terminals. The plurality of electronic components include a passive component disposed at the major surface. At least a portion of the first external connection terminal overlaps at least a portion of the passive component in plan view of the module substrate.