RF Module Frame Cavity Design for Compact Footprint
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Solution Overview
Problem
Conventional electronic component packaging methods result in large module footprints and are susceptible to mechanical damage, electromagnetic interference, and signal delays due to long wire lengths and inadequate protection of sensitive RF filter components.
Innovation Solution
A module design featuring a frame with a cavity that houses a semiconductor device, where a second semiconductor device seals the cavity, providing mechanical stability and reducing wire lengths, and a manufacturing method involving attaching a frame to an RF filter and sealing it with a semiconductor device to create a compact, protected RF module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic component packaging methods are used, then components can be mounted and connected, but the module footprint becomes large and mechanical protection is insufficient
Solution Approach 1:
The patent implements nesting by placing the RF filter inside a cavity formed by the frame structure, then sealing the cavity with a lid. This nested arrangement allows the filter to be housed within the protective frame structure, reducing the overall module footprint while providing mechanical protection through the enclosed cavity design.
Solution Approach 2:
The patent transitions from a planar packaging arrangement to a three-dimensional structure by creating a cavity with vertical walls and a lid. This dimensional change allows components to be arranged in multiple levels (filter inside cavity, lid on top), reducing the horizontal footprint while enhancing mechanical protection through the enclosed three-dimensional structure.
2Ease of operation
If long wire connections are used to connect components, then component placement is flexible, but electromagnetic interference and signal delays increase
Solution Approach 1:
The patent extracts and eliminates the need for long wire connections by implementing direct bump bonding between the RF filter and the support substrate. This removal of unnecessary wire length eliminates the source of electromagnetic interference and signal delays, while component placement flexibility is maintained through the direct mounting approach.
3Ease of manufacture
If components are mounted without adequate protection, then assembly is simple, but components are susceptible to mechanical damage and electromagnetic interference
Solution Approach 1:
The patent applies preliminary action by forming the protective frame structure and cavity before mounting the RF filter. The cavity is prepared in advance with appropriate positioning features, allowing the filter to be placed directly into the protected environment. This preliminary preparation ensures protection is already in place before the component is exposed to potential damage during assembly.
Solution Approach 2:
The patent introduces the frame structure and cavity as intermediary elements between the RF filter and the external environment. This intermediary structure provides mechanical protection and electromagnetic shielding while maintaining assembly simplicity through direct mounting of the filter into the pre-formed cavity, eliminating the need for complex protective assemblies.
4Volume of moving object
If a compact module design is implemented, then wire lengths are shortened and protection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functions into the frame structure: it provides mechanical support, forms the protective cavity, enables component mounting surfaces, and contributes to electromagnetic shielding. This consolidation of multiple functions into a single integrated structure achieves compact module design while reducing manufacturing complexity compared to assembling separate protective components.
Data Source
AI summary
A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.