RF Module Ground Layer Overlap for Better Component Shielding
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Solution Overview
Problem
Existing radio-frequency modules have insufficient shielding effects for radio-frequency components mounted on substrates, particularly with the increasing complexity of multiband communication systems.
Innovation Solution
A radio-frequency module is designed with a mounting substrate that includes a ground electrode layer formed by a planar wiring pattern, external connection terminals set to ground potential, and radio-frequency components mounted such that at least part of the component overlaps with the ground electrode layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If radio-frequency components are mounted on substrates with increased circuit elements for multiband communication, then communication functionality is improved, but the size of radio-frequency modules increases and shielding effect becomes insufficient
Solution Approach 1:
The patent transitions from planar ground electrode arrangements to three-dimensional overlapping structures. The ground electrode layer is positioned to overlap with radio-frequency components in the vertical dimension, creating a layered configuration that provides effective shielding while maintaining compact module size suitable for multiband communication devices
Solution Approach 2:
The ground electrode layer is nested within the vertical structure of the radio-frequency module, positioned between different circuit layers. This nested arrangement allows the ground layer to provide shielding for radio-frequency components while integrating seamlessly into the multi-layer substrate structure, improving shielding without increasing overall module dimensions
2Adaptability or versatility
If more circuit elements are added to support multiband communication, then communication capability is improved, but the overall module size increases
Solution Approach 1:
The patent utilizes vertical layering to accommodate multiple circuit elements and ground electrode layers within a compact footprint. By stacking components and ground layers in the vertical dimension rather than spreading them horizontally, the module supports multiband communication functionality while maintaining a reduced overall volume
Solution Approach 2:
Multiple functions are merged into integrated substrate structures. The ground electrode layer serves dual purposes: providing electrical grounding and providing shielding for radio-frequency components. This merging of functions reduces the need for separate shielding structures, thereby reducing overall module size while maintaining multiband communication capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the shielding effect of the radio-frequency components, reducing signal radiation and external noise interference, while stabilizing the ground potential.
Implementation Method 1
a ground electrode layer formed by a planar wiring pattern... multiple external connection terminals that are arranged on a first main surface of the mounting substrate and that is set to ground potential... at least part of the first radio-frequency component is overlapped with the ground electrode layer
Data Source
AI summary
A radio-frequency module includes a mounting substrate including a ground electrode layer formed by a planar wiring pattern; multiple ground terminals, which are multiple external connection terminals that are arranged on a first main surface of the mounting substrate and that are set to ground potential; and a first radio-frequency component (for example, a reception filter and/or a low noise amplifier) mounted on the first main surface. The multiple ground terminals are arranged at an outer periphery side of the first main surface with respect to the first radio-frequency component and are connected to the ground electrode layer. In a plan view of the mounting substrate, at least part of the first radio-frequency component is overlapped with the ground electrode layer.