RF Module Layout for High Isolation in Multiband Signal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In multiband communication devices, achieving high isolation between input and output terminals is challenging due to increasing mounting density of circuit elements and complex wiring patterns, which can lead to deterioration of signal isolation.
Innovation Solution
A radio-frequency module design featuring a semiconductor chip with integrated switches and filters on a multilayer substrate, where terminals and wiring patterns are strategically arranged to minimize electromagnetic interference, using a distinct configuration that separates input and output terminals and wiring layers to enhance isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If mounting density of circuit elements is increased to decrease module size, then productivity and compactness are improved, but isolation between input and output terminals deteriorates
Solution Approach 1:
The patent transitions from planar 2D arrangement of circuit elements to a 3D stacked configuration using multiple layers. The semiconductor chip is mounted on the substrate with input terminals on one layer and output terminals on another layer, separated by a ground layer. This vertical stacking enables compact module size while maintaining high isolation between input and output terminals through the grounding shield between layers.
2Adaptability or versatility
If complex wiring patterns are used to accommodate multiple signal paths, then adaptability is improved, but harmful electromagnetic interference increases
Solution Approach 1:
The patent segments the signal paths into distinct layers and routes. Each signal path has its own dedicated wiring pattern on specific layers, with ground layers separating different signal paths. This segmentation prevents electromagnetic coupling between adjacent signal paths while maintaining the ability to support multiple frequency bands and signal types through the switched network architecture.
3Area of stationary object
If input and output terminals are placed close together to reduce area, then manufacturing cost is improved, but signal isolation deteriorates
Solution Approach 1:
The patent resolves the area-isolation conflict by moving the isolation problem from the 2D plane to the 3D vertical dimension. Input terminals and output terminals are positioned close together in the planar view but are separated vertically by a ground layer. This allows compact terminal arrangement while maintaining signal isolation through the intermediate grounding plane that shields against electromagnetic coupling.
Data Source
AI summary
A radio-frequency module includes a first terminal configured to receive a signal from an antenna, a substrate, a first filter element on the substrate, a first switch including a first switch terminal and a second switch terminal connectable to the first switch terminal, and connected between the first terminal and the first filter element, and a second switch including a third switch terminal. The first filter element is connected between the second switch terminal and the third switch terminal, the first switch and the second switch are included in a semiconductor chip, and the semiconductor chip is on the substrate.