RF Module Board Layout for Tx/Rx Inductor Isolation
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Solution Overview
Problem
In compact mobile communication devices, electromagnetic field coupling between inductance components of transmission and reception circuits in radio frequency front-end circuits leads to reduced reception sensitivity due to harmonic and intermodulation distortion components.
Innovation Solution
The radio frequency module is designed with a module board having distinct principal surfaces for mounting transmission and reception circuit components, including inductance elements, to prevent electromagnetic field coupling by separating the inductance components and using resin members for mechanical strength and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the transmitter and receiver are located in close proximity in a compact module, then the module size is reduced, but electromagnetic field coupling occurs between inductance components causing deterioration of reception sensitivity
Solution Approach 1:
The patent applies dimensionality change by mounting the first inductance element on the first principal surface and the second inductance element on the second principal surface (opposite side) of the module board. This spatial separation in the vertical dimension reduces electromagnetic field coupling between the transmitter and receiver inductance components while maintaining compact module size, thereby preventing deterioration of reception sensitivity.
2Ease of manufacture
If inductance components are placed close together for compactness, then manufacturing is simplified, but electromagnetic field coupling causes harmonic and intermodulation distortion to flow into the receiver
Solution Approach 1:
The patent resolves the manufacturing simplicity versus electromagnetic coupling contradiction by utilizing the vertical dimension through opposite surface mounting. This approach maintains ease of manufacture through standard surface-mount technology while effectively reducing electromagnetic field coupling between inductance components, preventing harmful harmonic and intermodulation distortion from affecting the receiver.
3Device complexity
If transmission and reception circuits are integrated in a single module, then device complexity is reduced, but isolation between circuits deteriorates due to electromagnetic coupling
Solution Approach 1:
The patent achieves both circuit integration and reliable isolation by mounting inductance elements on opposite principal surfaces of the module board. This dimensional separation maintains compact single-module integration while providing effective electromagnetic isolation between transmission and reception circuits, ensuring reliable operation without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces electromagnetic field coupling, thereby preventing deterioration of reception sensitivity and improving the isolation between transmission and reception circuits.
Implementation Method 1
electromagnetic field coupling may occur between inductance components of the output circuits of the transmitter (a transmission path) and inductance components of the input circuits of the receiver (the reception path)
Data Source
AI summary
A radio frequency module includes a module board, a transmission power amplifier, a first inductance element connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element connected to an input terminal of the reception low-noise amplifier. The first inductance element is mounted on a first principal surface of the module board, and the second inductance element is mounted on a second principal surface of the module board.