Radio Frequency Module Interposer for Heat and EMI Management
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Solution Overview
Problem
Current radio frequency modules face challenges in efficiently handling high-frequency signals and power management, leading to increased power consumption and heat dissipation issues, particularly when integrating front-end amplification circuits, which complicates performance and size optimization.
Innovation Solution
The radio frequency module separates the front-end integrated circuit (FEIC) for front-end amplification and the radio frequency integrated circuit (RFIC) for other operations, using an interposer with alternately stacked insulating and wiring layers for electromagnetic isolation and efficient heat dissipation, and includes power management integrated circuits and patch antenna patterns for improved power distribution and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the front-end IC and RFIC are integrated into a single chip, then device complexity is reduced, but heat dissipation becomes difficult and power efficiency deteriorates
Solution Approach 1:
The patent divides the radio frequency module into separate functional components: a front-end IC for power amplification and an RFIC for signal processing, mounted on different surfaces of an interposer. This segmentation allows each component to have dedicated heat dissipation paths and power management, resolving the contradiction between integration and heat management.
2Volume of moving object
If the front-end IC is placed close to the RFIC for compact design, then device size is reduced, but electromagnetic interference increases and signal integrity deteriorates
Solution Approach 1:
The patent introduces an interposer as an intermediary substrate between the front-end IC and RFIC. The interposer provides electromagnetic shielding layers and controlled impedance transmission lines that isolate the two ICs from each other, preventing interference while maintaining a compact overall module size.
3Adaptability or versatility
If high-frequency signals are transmitted through long wiring paths, then device layout flexibility increases, but transmission loss increases and signal quality deteriorates
Solution Approach 1:
The patent implements local quality optimization by providing dedicated, short wiring paths on the interposer specifically for high-frequency signals between the RFIC and front-end IC. The interposer features controlled impedance transmission lines and minimal via structures in the signal path, ensuring low loss while allowing flexible overall module layout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances power efficiency, reduces transmission loss, and effectively manages heat dissipation, allowing for a compact size while maintaining performance, especially in high-frequency applications.
Implementation Method 1
an interposer with alternately stacked insulating and wiring layers for electromagnetic isolation
Implementation Method 2
a heat dissipation member disposed on a surface of the RFIC opposite to the interposer
Data Source
AI summary
A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.