RF Module Layout With Overlapped LNA and Inductor to Cut Wiring Loss
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Solution Overview
Problem
Existing radio frequency modules with low-noise amplifiers and inductors on the same principal surface experience wiring losses due to longer distances between these components, leading to inefficiencies and increased size.
Innovation Solution
The radio frequency module is designed with the low-noise amplifier on one principal surface and the inductor on the opposite surface of the mounting board, allowing at least part of the inductor's footprint to overlap with the low-noise amplifier, thereby shortening the wiring length and reducing losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the inductor and low-noise amplifier are arranged on the same principal surface, then the wiring connection is straightforward, but the wiring length increases causing higher loss
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked arrangement by placing the inductor on the first principal surface and the low-noise amplifier on the second principal surface of the mounting board. This vertical stacking reduces the horizontal wiring length while maintaining electrical connection, directly addressing the wiring loss issue.
2Loss of energy
If the inductor and low-noise amplifier are placed on opposite surfaces, then wiring length is reduced, but the module height increases
Solution Approach 1:
The patent accepts the increased height in the vertical dimension as a necessary trade-off to achieve significant reduction in wiring length and associated losses. The mounting board's thickness provides the separation distance, enabling the stacked configuration that prioritizes signal integrity over compact height.
Data Source
AI summary
Loss caused by wiring is reduced. A radio frequency module includes a mounting board, a low-noise amplifier, and an input matching circuit. The mounting board has a first principal surface and a second principal surface. The first principal surface and the second principal surface are on opposite sides of the mounting board. The low-noise amplifier amplifies a reception signal (first reception signal). The input matching circuit includes an inductor. The inductor is connected to the input side of the low-noise amplifier. The inductor is arranged on the first principal surface side of the mounting board. The low-noise amplifier is arranged on the second principal surface side of the mounting board. In a plan view seen from a thickness direction of the mounting board, at least part of the inductor overlaps with at least part of the low-noise amplifier.