RF Module Component Placement to Reduce Magnetic Coupling

Solution Overview

Problem

Conventional radio frequency modules with integrated components suffer from reduced isolation characteristics and deteriorated electrical characteristics, such as noise figure and gain, due to component integration.

Innovation Solution

A radio frequency module design featuring a power amplifier, inductor, low-noise amplifier, matching circuit, and substrate configuration where components are disposed on opposite sides of the module substrate, reducing magnetic field coupling and improving electrical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If many components are integrated to downsize the module, then the module size is reduced, but the isolation characteristics between components and lines deteriorate, causing electrical characteristics to worsen

Engineering Contradiction:

Improvemodule sizeVSAvoidelectrical characteristics

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The module substrate is divided into multiple isolation regions (first isolation region, second isolation region, third isolation region) that physically separate different functional components. The power amplifier, low-noise amplifier, and matching circuit are placed in different isolation regions, preventing mutual interference while maintaining compact overall size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Isolation structures (isolation grounds or shielding elements) are introduced as intermediary elements between adjacent components. These isolation structures act as mediators that block electromagnetic coupling and noise transmission between the power amplifier, low-noise amplifier, and matching circuit, thereby improving isolation characteristics without increasing module footprint.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If components are closely integrated, then the module size is reduced, but magnetic field coupling between components increases, deteriorating electrical characteristics

Engineering Contradiction:

Improvemodule sizeVSAvoidmagnetic field coupling

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The module substrate is divided into multiple isolation regions (first isolation region, second isolation region, third isolation region) that physically separate different functional components. The power amplifier, low-noise amplifier, and matching circuit are placed in different isolation regions, preventing mutual interference while maintaining compact overall size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Isolation structures (isolation grounds or shielding elements) are introduced as intermediary elements between adjacent components. These isolation structures act as mediators that block electromagnetic coupling and noise transmission between the power amplifier, low-noise amplifier, and matching circuit, thereby improving isolation characteristics without increasing module footprint.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the electrical characteristics of the radio frequency module by minimizing magnetic field coupling and noise interference, leading to improved reception performance and downsizing of the module.

Implementation Method 1

reducing magnetic field coupling and improving electrical characteristics

Methodology Applied

Scientific EffectMagnetic field coupling: Magnetic Field

Data Source

PatentUS11476886B2Radio frequency module and communication device

Publication Date: 2022.10.18 MURATA MFG CO LTD

AI summary

A radio frequency module includes: a power amplifier; an inductor connected to the power amplifier; an external connection terminal that is connected to the power amplifier via the inductor and is configured to receive a power supply voltage from an outside source; a low-noise amplifier; a matching circuit connected to input of the low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The inductor is disposed on one of the first principal surface and the second principal surface, and the matching circuit is disposed on the other of the first principal surface and the second principal surface.