RF Module Stepped Resin and Shielding Wall
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Solution Overview
Problem
Traditional radio frequency modules face challenges in miniaturization and component arrangement due to unnecessary resin portions and limited freedom in component placement, especially when components of different thicknesses are mounted on a wiring substrate, leading to mutual noise interference.
Innovation Solution
A radio frequency module design featuring a sealing resin layer with a stepped area on its surface and a shielding wall that intersects this area, allowing for improved component arrangement and reduced resin usage, with a shielding film covering the resin layer and shielding wall to enhance noise shielding characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a flat sealing resin layer is used to cover components of different thicknesses, then all components are covered, but unnecessary resin portions increase the module size
Solution Approach 1:
The sealing resin layer is segmented into multiple height levels (first height and second height) corresponding to different component thicknesses. This segmentation allows the resin to precisely cover each component without creating unnecessary material, thereby reducing overall module volume while maintaining complete component coverage.
Solution Approach 2:
Different regions of the sealing resin layer are given different heights (local quality variation) to match the thickness of underlying components. The first height region covers thicker components while the second height region covers thinner components, eliminating wasted resin material and reducing the module's overall volume.
2Volume of moving object
If components are arranged closely to reduce module size, then miniaturization is achieved, but noise interference between components increases
Solution Approach 1:
A shielding wall is introduced as an intermediary structure between adjacent components. This shielding wall, positioned within grooves of the sealing resin layer, acts as a barrier that blocks electromagnetic noise and interference between components, allowing them to be arranged closely without compromising signal integrity.
Solution Approach 2:
The shielding wall is nested within the groove structure of the sealing resin layer, creating a compact configuration. The groove contains the shielding wall while maintaining the overall compact module design, allowing noise shielding functionality to be integrated without increasing module volume.
3Object-generated harmful factors
If a shielding wall is added to prevent noise interference, then shielding effectiveness improves, but device complexity increases
Solution Approach 1:
The shielding wall formation process is merged with the existing groove structure of the sealing resin layer. The groove serves dual purposes: it provides structural definition for the resin layer and simultaneously houses the shielding wall. This merging eliminates the need for separate shielding structures, maintaining simplicity while achieving effective noise shielding.
4Volume of moving object
If the sealing resin layer is made thinner to reduce module size, then miniaturization is achieved, but component coverage and shielding effectiveness deteriorate
Solution Approach 1:
The sealing resin layer is segmented into different height regions (first height and second height) that precisely match the thickness of different components. This segmentation allows the resin layer to provide adequate coverage for each component individually while maintaining an overall compact profile, thus achieving miniaturization without sacrificing coverage or shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces unnecessary resin portions, enhances the degree of freedom in component arrangement, and improves shielding effectiveness between components, contributing to a more compact and efficient radio frequency module.
Implementation Method 1
a shielding wall made of a conductor and arranged in the groove... preventing mutual interference of noise between the components
Implementation Method 2
a shield layer 105 covers the surface of the sealing resin layer 103 and is made of a conductive resin charged in the trench 104
Data Source
AI summary
A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.