High-Frequency Module Ground Terminal Layout for Heat Dissipation
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Solution Overview
Problem
Existing high frequency modules in mobile communication devices face challenges in achieving a compact size while effectively dissipating heat generated by power amplifiers.
Innovation Solution
The design incorporates a module substrate with a power amplifier on one main surface and external connection terminals on the opposing surface, connected via conductors to facilitate heat dissipation, reducing thermal resistance and improving heat dissipation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipating means is provided for the power amplifier, then heat dissipation characteristics are improved, but the module size increases
Solution Approach 1:
The invention transitions from planar heat dissipation to three-dimensional heat dissipation by extending the external connection terminal in the thickness direction of the substrate. The terminal includes a first end surface at the first main surface side and a second end surface at the second main surface side, creating a vertical heat dissipation path that reduces thermal resistance without increasing the module's planar footprint.
Solution Approach 2:
The external connection terminal is designed with asymmetric geometry where the second end surface area is larger than the first end surface area. This asymmetric design optimizes heat dissipation efficiency by providing a larger heat dissipation area at the second main surface side while maintaining compact dimensions at the power amplifier side, effectively resolving the contradiction between heat dissipation performance and module size.
2Temperature
If the external connection terminal has a larger second end surface area, then heat dissipation efficiency is improved, but the terminal complexity increases
Solution Approach 1:
The external connection terminal serves multiple functions: it provides electrical connection between the power amplifier ground electrode and the external ground, acts as a heat dissipation path from the first main surface to the second main surface, and the asymmetric end surfaces provide optimized thermal management. This multi-functionality reduces the need for separate heat dissipation structures, thereby limiting complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact high frequency module with enhanced heat dissipation, reducing thermal resistance and maintaining efficient signal transmission.
Implementation Method 1
a via conductor that is formed inside the module substrate and connects the first main surface to the second main surface. One end of the via conductor is bonded to a ground electrode of the power amplifier on the first main surface, and an other end of the via conductor is bonded to a first end surface of the first external connection terminal on the second main surface
Data Source
AI summary
A high frequency module includes a module substrate that includes main surfaces facing each other, a power amplifier that is disposed on the main surface and capable of amplifying a transmission signal, an external connection terminal that is disposed on the main surface and set to a ground potential, and a via conductor that is formed inside the module substrate and connects the main surfaces. One end of the via conductor is bonded to a ground electrode of the power amplifier on the main surface, and the other end of the via conductor is bonded to an end surface of the external connection terminal on the main surface. An area Rb of an end surface that is opposite to the end surface of the external connection terminal is larger than an area of a cut surface that is in parallel to the main surface of the external connection terminal.