RF Module Via Conductor Varying Sectional Area
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Solution Overview
Problem
Existing radio frequency modules face challenges in reducing size while maintaining good radio frequency characteristics, as thinner conductors increase impedance and degrade performance.
Innovation Solution
A radio frequency module design featuring a via conductor with varying sectional areas and orientations, allowing for shorter wiring lines and improved impedance control, embedded in an insulating layer with a surface acoustic wave filter, enabling increased layout freedom and reduced module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the conductor thickness is decreased to reduce wiring space, then the module size is reduced, but the impedance increases and radio frequency characteristics are degraded
Solution Approach 1:
The via conductor is designed with different sectional areas at different portions: a first portion with a smaller sectional area for impedance control and a second portion with a larger sectional area for reduced resistance. This local variation in geometry allows simultaneous optimization of both impedance matching and signal transmission quality, resolving the contradiction between space reduction and performance maintenance.
Solution Approach 2:
The patent changes the geometric parameters of the via conductor by varying its sectional area along its length. Specifically, the conductor transitions from a smaller cross-section at the first portion to a larger cross-section at the second portion, enabling independent optimization of electrical characteristics at different locations within the same conductor structure.
2Adaptability or versatility
If the conductor thickness is decreased to increase layout freedom, then the wiring flexibility is improved, but the radio frequency characteristics are degraded
Solution Approach 1:
The via conductor employs different sectional areas at different portions to locally optimize for different requirements: the first portion with smaller area provides impedance control for signal integrity, while the second portion with larger area provides current carrying capacity and reduced resistance, enabling both layout flexibility and performance.
3Volume of moving object
If the module size is reduced by embedding electronic components, then the compactness is improved, but the wiring space becomes more constrained
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by embedding the electronic component within the insulating layer and using via conductors that extend vertically through the insulating layer. This dimensional change allows wiring to occur in both horizontal and vertical directions, effectively increasing the available wiring space within a compact footprint.
Data Source
AI summary
A radio frequency module includes a first electronic component embedded in an insulating layer, a wiring line connected to the first electronic component, and a via conductor extending in a direction perpendicular or substantially perpendicular to a main surface of the insulating layer and including a first portion and a second portion. The first portion of the via conductor is connected to the wiring line. A sectional area of the first portion of the via conductor in a direction parallel or substantially parallel to the main surface of the insulating layer differs from a sectional area of the second portion of the via conductor in the direction parallel or substantially parallel to the main surface of the insulating layer.