RF Module Package Structure Without Wire Bonding Loss

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Solution Overview

Problem

Conventional packaging approaches for RF modules limit RF performance and are incompatible with environmental protection due to size constraints, making it challenging to maximize RF performance and provide robustness in miniaturized form-factors.

Innovation Solution

A packaging device with conductive structures, including via structures and bonding structures, that facilitate signal transmission and heat dissipation without wire bonding, allowing for compact integration and environmental protection of RF modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional packaging approaches are used for RF modules, then the packaging structure is simple and easy to manufacture, but RF performance is limited and environmental protection is incompatible due to size constraints

Engineering Contradiction:

ImproveRF performanceVSAvoidpackaging structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent transitions from planar packaging to three-dimensional vertical stacking architecture. Multiple functional layers (conductive layer, dielectric layer, via structures) are stacked vertically to achieve compact integration while maintaining RF performance. This dimensional change enables environmental protection and signal transmission simultaneously in a miniaturized form factor.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The packaging structure employs nested configurations where via structures are embedded within conductive layers, which are themselves embedded within dielectric layers. The lid encloses the entire stacked structure, creating a nested hierarchy that maximizes space utilization and provides environmental protection while maintaining electrical connectivity.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Volume of moving object

If miniaturization of RF modules is pursued, then size constraints are addressed, but environmental protection becomes incompatible with conventional packaging

Engineering Contradiction:

ImproveRF module sizeVSAvoidenvironmental protection

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent employs a lid structure that encloses the stacked layers, forming a protective shell around the miniaturized RF module. This shell provides environmental protection while maintaining the compact size. The lid is integrated with the vertical stacking architecture, allowing protection without significant volume increase.

Inventive Principle:

Principle #30Flexible shells and thin films

3Loss of energy

If wire bonding is used for signal transmission, then manufacturing is simple, but RF losses increase and heat dissipation is insufficient

Engineering Contradiction:

ImproveRF lossesVSAvoidmanufacturing complexity

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The patent replaces wire bonding (mechanical connection method) with direct conductive layer integration and via structures. This substitution eliminates the need for separate wire bonding steps, reduces RF losses by providing shorter and more direct signal paths, and improves heat dissipation through thermal conduction via the conductive layers and vias.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent merges the functions of signal transmission and heat dissipation into the same conductive structures. The conductive layers and via structures simultaneously serve as electrical interconnects and thermal pathways, eliminating the need for separate wire bonding for signal transmission and separate thermal management structures.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces RF losses and improves heat dissipation, enabling efficient signal transmission and environmental protection in miniaturized RF modules while maintaining RF performance.

Implementation Method 1

a first patterned conductive layer disposed between the die and the interposer, and between the lid and the interposer, and a second patterned conductive layer disposed between the laminate and the interposer, wherein the first patterned conductive layer includes a bonding structure electrically connected to the first via structure and the second via structure

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the first patterned conductive layer includes a bonding structure electrically and thermally connected to the first via structure and the second via structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260068703A1Packaging devices and methods for forming the same

Publication Date: 2026.03.05 QORVO US INC

AI summary

A packaging device is provided. The packaging device includes a die disposed over a laminate, the die comprising a first via structure, and an interposer disposed between the die and the laminate. The interposer includes a second via structure. The packaging device also includes a lid disposed over the interposer and covering the die, a first patterned conductive layer disposed between the die and the interposer, and between the lid and the interposer; and a second patterned conductive layer disposed between the laminate and the interposer. The first patterned conductive layer includes a bonding structure electrically and thermally connected to the first via structure and the second via structure.