Solid State RF Power Amplifier Parallel Modules

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current solid state RF power amplifiers are limited in their ability to efficiently operate at microwave and millimeterwave frequencies with wide bandwidth and high power, necessitating improved designs for efficient operation and heat management.

Innovation Solution

A high power, wideband solid state RF power amplifier design featuring multiple parallel sub-amplifier modules with identical electrical paths and heat management systems, including a non-planar configuration with pre-amp, splitter, and combiner modules, and flexible transmission lines with low insertion loss, to ensure efficient power amplification and heat extraction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If solid state RF power amplifiers are designed for high power output, then power amplification capability is improved, but heat generation increases making heat extraction difficult

Engineering Contradiction:
Improvepower amplification capabilityVSAvoidheat extraction difficulty
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The amplifier is divided into multiple parallel power amplifier modules (first, second, third, and fourth modules) that can be independently managed. Each module has its own heat management approach, allowing distributed heat dissipation across multiple components rather than concentrating thermal load in a single unit, thereby improving overall heat extraction efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple power amplifier modules are combined in parallel to achieve high power output while maintaining individual module thermal management. The modules share common input and output signal paths but maintain separate thermal zones, allowing the system to achieve high total power while each module operates within manageable thermal limits.

Inventive Principle:
Principle #5Merging (Combining)

2Power

If multiple parallel power amplifier modules are used to achieve high power output, then power amplification is improved, but device complexity increases

Engineering Contradiction:
Improvehigh power outputVSAvoidnumber of modules and connections
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The power amplifier modules are designed with identical or substantially similar input and output signal path configurations, making them universally interchangeable. Each module follows the same architectural pattern with standardized connection interfaces, allowing complex multi-module systems to be constructed from replicated modular units, thereby managing complexity through standardization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Each power amplifier module is designed with specific local characteristics optimized for its function, including dedicated input and output signal paths that are substantially identical within each module. This modular local optimization allows the overall system to achieve high power while maintaining manageable complexity through repetition of proven local designs.

Inventive Principle:
Principle #3Local quality

3Volume of moving object

If flexible transmission lines with tight bending are used to save space, then compactness is improved, but insertion loss increases

Engineering Contradiction:
Improveamplifier housing sizeVSAvoidinsertion loss
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent employs flexible transmission lines that can be bent to tight radii without excessive insertion loss. These flexible transmission line structures allow the amplifier to achieve compact housing dimensions while maintaining acceptable signal transmission characteristics, resolving the contradiction between compactness and insertion loss through specialized flexible conductor design.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS7746175B2Solid state RF power amplifier
Publication Date: 2010.06.29 HITTITE MICROWAVE LLC
  • US7746175B2 patent drawing
  • US7746175B2 patent drawing
  • US7746175B2 patent drawing

AI summary

A power amplifier (power amplifier) having multiple solid state sub-amplifiers connected in parallel between the power amplifier input and the power amplifier output are described. The signal input to the power amplifier is provided to an RF splitter connected between the power amplifier input connector and the input of each of the sub-amplifiers. The RF splitter splits the input power from the signal input and provides the power to the sub-amplifier inputs through input electrical paths. The input electrical paths from the power amplifier input to the sub-amplifiers are substantially physically identical. Each of the sub-amplifiers drive an input of an RF combiner connected between the outputs of the sub-amplifiers and the output of the power amplifier. The RF combiner combines the output power from each of the sub-amplifiers through output electrical paths, and provides the combined power to the power amplifier output. The output electrical paths from the sub-amplifiers to the power amplifier output are substantially physically identical.