Integrated RF Receiver Filters Using On-Chip Inductors
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Solution Overview
Problem
Existing radio frequency (RF) receivers, particularly television receivers, face challenges in achieving high quality and low cost due to the need for discrete components like inductors and varactors, which are expensive and bulky, while silicon-based integrated circuit solutions do not perform well and require external components, limiting the cost reduction benefits of integrated circuit technology.
Innovation Solution
A radio frequency receiver architecture that combines a tracking bandpass filter with an integrated passive device (IPD) die and a main integrated circuit die into a multi-chip module (MCM), using inductors fabricated on the IPD die to avoid expensive silicon manufacturing and integrate high-quality filtering with low-cost, compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components (inductors, varactors, capacitors) are used to build high quality television receivers, then receiver performance is improved, but cost and size increase
Solution Approach 1:
The patent combines multiple discrete components (inductors, varactors, capacitors) into an integrated circuit chip, merging their functions into a single packaged unit. This integration maintains the high performance characteristics of discrete components while reducing overall cost and size through standardized manufacturing processes and compact packaging.
Solution Approach 2:
The patent implements a hierarchical integration structure where individual components are nested within functional blocks, which are then nested within the integrated circuit chip, and finally packaged together with external components in a module. This nested arrangement allows systematic reduction of size and complexity while preserving performance.
2Reliability
If discrete components are used, then receiver performance is improved, but device size increases
Solution Approach 1:
Multiple discrete components are merged into a single integrated circuit chip, dramatically reducing the physical volume required. The chip-scale integration allows components that would traditionally occupy separate discrete spaces to coexist in a compact three-dimensional arrangement on the chip substrate.
Solution Approach 2:
The nested integration hierarchy (components within blocks, blocks within chip, chip within package) enables systematic volume reduction at each level, allowing high-performance receiver functionality to be achieved in a compact form factor suitable for modern portable applications.
3Ease of manufacture
If silicon-based integrated circuit technology is used, then cost is reduced, but receiver performance deteriorates
Solution Approach 1:
The patent employs advanced CMOS fabrication parameters and process optimizations to achieve RF performance characteristics previously only attainable with discrete components. By carefully controlling electrical parameters (transistor dimensions, doping profiles, interconnect geometries) during manufacturing, the integrated circuit achieves high Q-factor resonators and low-noise amplification despite using standard silicon technology.
Solution Approach 2:
The patent replaces traditional mechanical/discrete component-based RF circuits with solid-state integrated circuit implementations. This substitution eliminates the performance limitations of discrete components while maintaining compatibility with cost-effective silicon manufacturing processes, achieving both low cost and high performance through electronic rather than mechanical means.
4Ease of manufacture
If integrated circuit technology is used, then cost is reduced, but external components are still required
Solution Approach 1:
The integrated circuit chip is designed with multi-functional blocks that can operate in different modes or configurations depending on the application. This universality allows the same chip to serve multiple functions (RF amplification, filtering, frequency synthesis) reducing the need for additional external components while maintaining cost-effectiveness through standardized manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-quality RF filtering with low signal-to-noise ratio at reduced costs, sharing RF filtering between tracking bandpass and lowpass filters, and efficiently fabricating inductors on an IPD die, resulting in a cost-effective and compact receiver design.
Implementation Method 1
inductors fabricated on an integrated passive device (IPD) die
Implementation Method 2
tracking bandpass filter with an integrated passive device (IPD) die
Data Source
AI summary
An integrated wideband receiver includes first and second signal processing paths and a controller. The first signal processing path has an input, and an output for providing a first processed signal, and comprises a first tracking bandpass filter having a first integrated inductor. The second signal processing path has an input, and an output for providing a second processed signal, and comprises a second tracking bandpass filter having a second integrated inductor. The controller is for enabling one of the first and second signal processing paths corresponding to a selected channel of a radio frequency (RF) input signal to provide an output signal. The controller, the first integrated inductor, and said second integrated inductor are formed on a single integrated circuit chip.