RF Semiconductor Package Antenna Isolation
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Solution Overview
Problem
Semiconductor devices with integrated ESD protection circuits suffer from degradation of radio frequency signal properties due to the ESD protection circuit acting as a low-pass filter, and the lack of ESD protection leads to potential destruction during handling, compromising the functionality of mobile communication equipment.
Innovation Solution
A semiconductor device package design that includes a semiconductor chip with external antenna conductors connected via antenna connection pins and a suspending pin, eliminating the need for an integrated ESD protection circuit by using a matching circuit connected to the semiconductor chip at two points, allowing for a separate external antenna and maintaining impedance without the need for ESD protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an ESD protection circuit is integrated on the semiconductor chip, then the chip is protected from ESD destruction, but the radio frequency signal properties are degraded due to the low-pass filter effect
Solution Approach 1:
The invention separates the ESD protection function from the RF signal path by providing two distinct connection modes: a first connection mode for RF signals that bypasses the ESD protection circuit, and a second connection mode for ESD protection. This segmentation allows the RF signal to maintain its properties while the ESD protection circuit remains available for protecting the chip during handling.
Solution Approach 2:
The invention implements dynamic switching between two connection modes using a switch controlled by a control signal. When the control signal indicates RF operation, the switch connects the antenna to the RF input/output circuit directly. When the control signal indicates ESD protection mode, the switch connects the antenna to the ESD protection circuit, thereby adapting the connection based on operational requirements.
2Volume of moving object
If the antenna is integrated within the semiconductor device package, then the device size is reduced, but the antenna performance and communication distance are degraded
Solution Approach 1:
The invention extends the antenna structure from the two-dimensional plane of the semiconductor chip into the third dimension by using bonding wires to connect the antenna to external conductors. This allows the antenna to achieve its required electrical length and performance characteristics while keeping the packaged device footprint compact.
Solution Approach 2:
The bonding wires serve as intermediaries that extend the antenna structure from the semiconductor chip to external conductors on the circuit board. This intermediary approach allows the antenna to function effectively with a longer effective length while the physical package size remains small, resolving the contradiction between compact size and antenna performance.
3Device complexity
If the antenna connection passes through the island and suspending pin, then the structure is simplified, but the impedance is altered and antenna performance is degraded
Solution Approach 1:
The invention extracts the antenna connection path from the mechanical support structure (island and suspending pin) and creates a separate, dedicated RF signal path. The antenna is connected to the RF input/output circuit through specific antenna connection pins that are electrically isolated from the island and suspending pin, thereby preventing impedance alteration while maintaining structural simplicity.
Data Source
AI summary
A semiconductor device includes: a semiconductor chip configured to process a signal in a radio frequency band; two conductive antenna connection pins connected with two external antenna conductors, respectively; an island for the semiconductor chip to be mounted thereon; a suspending pin connected with the island; and an antenna connection conductor configured to connect the two antenna connection pins without connection with the island and the suspending pin. A series connection of one of the two external antenna conductors, one of the two antenna connection pins, the antenna connection conductor section, the other of the two antenna connection pins and the other of the two external antenna conductors in this order, functions as an antenna by connecting the series connection with the semiconductor chip.