RF Shielding Via Density Optimization for EMI Isolation
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Solution Overview
Problem
Existing packaged semiconductor structures face challenges in efficiently providing radio frequency (RF) isolation while minimizing the area consumption and cost, as the high density of vias required for effective RF shielding consumes significant die area and increases costs.
Innovation Solution
The method involves determining the optimal placement and density of vias based on electromagnetic interference (EMI) data, adjusting the via density in areas with high EMI to strengthen RF isolation without excessive area usage, and iteratively optimizing via placement to meet EMI specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high density of vias is used for effective RF shielding, then RF isolation performance is improved, but die area consumption increases and manufacturing cost increases
Solution Approach 1:
The patent applies local quality by varying via density across different regions of the shield structure. High via density is concentrated at critical locations such as corners and edges where electromagnetic interference is most severe, while lower density is used in less critical areas. This localized approach maintains effective RF isolation performance while significantly reducing overall via count and die area consumption compared to uniform high-density via patterns.
2Reliability
If high density of vias is used for effective RF shielding, then RF isolation performance is improved, but manufacturing cost increases
Solution Approach 1:
By concentrating vias only where electromagnetic interference is most severe (corners, edges, and high-interference zones), the patent reduces the total number of vias required. This localized via placement strategy decreases manufacturing complexity and cost while maintaining adequate RF isolation performance, as vias are not wasted in low-interference regions where they provide minimal benefit.
Solution Approach 2:
The patent extracts and removes unnecessary vias from low-interference regions, keeping only the essential vias needed for effective shielding. This selective removal process reduces via count and associated manufacturing costs while preserving the core RF isolation functionality provided by strategically positioned vias at critical locations.
3Ease of manufacture
If uniform via distribution is used, then manufacturing simplicity is maintained, but RF isolation efficiency decreases
Solution Approach 1:
The patent replaces uniform via distribution with a non-uniform, location-optimized via pattern that concentrates vias at critical interference zones. This approach sacrifices the simplicity of uniform placement but dramatically improves RF isolation efficiency by targeting via placement where it is most needed, based on electromagnetic field analysis and interference patterns.
Data Source
AI summary
Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.